Bardia Sayyar

Hardware engineering student with hands-on experience in PCB design, embedded firmware, and sensor integration. Skilled in KiCad schematic/layout design, SMD soldering and rework, and BLE-based embedded systems. Proven ability to take hardware from prototype to production-ready Gerber files in fast-paced, cross-functional environments.

Computer Engineering Intern at Advanced Mobile Payment (AMP) (2026-06 – Present)

• Design electronic interface circuits for payment terminals using KiCad, enabling communication with external control and sensing equipment.
• Develop custom schematics, PCB layouts, and routing in KiCad, generating manufacturing-ready Gerber files for prototyping and production.
• Assemble and rework PCB prototypes by soldering surface-mount (SMD) components, including resistors, capacitors, connectors, and ICs.
• Develop hardware solutions to process external input signals, letting third-party systems interact with payment terminal controllers.
• Perform circuit validation, debugging, and troubleshooting to verify hardware functionality and system integration.

Computer Engineering Intern at Movia Media (2026-04 – 2026-06)

• Configured and deployed GPS and impression-tracking sensors via firmware installation, testing, and hardware setup.
• Troubleshot sensor failures using hardware diagnostics and SQL queries to identify and resolve issues.
• Improved sensor deployment and repair workflows through testing, validation,

Bachelor's of Engineering in Hardware – Toronto Metropolitan University (2023 – 2028)