DeeplightAre you eager to make an impact on the future of sensing and communications and be part of a dynamic start-up at the forefront of technology? For expanding our team in Lausanne, Switzerland, we are looking for talented photonics packaging engineer with strong experimental skills and a solid background in photonics.
The company Deeplight is a privately held high-tech spin-off company, founded in 2021 by researchers from the Swiss Federal Institute of Technology in Lausanne, Switzerland (EPFL) and from Karlsruhe Institute of Technology (KIT), Germany.
We specialize in developing frequency-agile laser sources and optical frequency combs with ultra-low phase noise based on advanced photonic integrated circuits.
Our technology base enables us to cater to scientific, industrial, and consumer markets with significant economic potential. By bridging the gap between scientific-grade laser systems and widely used semiconductor laser diodes, we bring low-noise, highly compact single- and multi-wavelength laser systems to various applications, such as autonomous driving, optical communication for space, quantum computing, quantum cryptography, fiber sensing, and more.
We are currently seeking a motivated engineer to contribute to the assembly of cutting-edge photonic integrated lasers
Development of photonic packaging of hybrid-integrated optoelectronic devices using semi-automated industrial grade equipment
Thermal and mechanical engineering of photonic assemblies
Root Cause Analysis and Corrective Action (RCCA) on assembled devices
Management of supply chain and assembly planning according to production demand
Setting up assembly operations as a pathway for industrial volume manufacturing
Your Profile You enjoy an autonomous work environment where you can take ownership and make a difference and are eager to continue independent learning.
Beyond a curious and open mind and a sense of accountability for your work, candidates should possess the following qualities:
MSc or PhD in optical or photonics engineering or adjacent field.
Experience with assembly of semiconductor lasers and optoelectronics and/or silicon photonics packaging using active alignment.
Experience with CAD modeling, mechanical and thermal engineering of hybrid assemblies.
Experience with programming languages for automation such as LabView/Python/MATLAB.
Industrial experience is preferred.
Excellent proficiency of English along with strong communication skills.
We offer The opportunity to define and shape from ground a high-tech company in integrated photonics technology for LiDAR, sensing, industrial metrology, and space communication.
A place where you can develop your skills in a growing team committed to Agile methodologies with the room to take ownership and to bring in your ideas.
Continued learning, both through on-the-job training and formal training.
Competitive compensation and a flexible and inspiring work culture, in the beautiful location of Lausanne, Switzerland.
Activity rate: 80-100%.
As soon as possible.
Please submit your application by filling out the form at the following link:
We are a small team fully committed to addressing our current business requirements. Consequently, the review and interview process may take some time. Thank you in advance for your patience and understanding. Rest assured that if your background and experience meet the requirements of the position, we will reach out to you.
If not, please accept our apologies for not being able to respond to all candidates. We greatly appreciate your interest in our company. Once the position has been filled, we will delete all applicants' data within the next six months, unless you request an earlier deletion.
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