芯片贴装工艺工程师/Die Attach Process Engineer
职位描述
Job Description
岗位职责:
- 负责半导体封装Die Attach(固晶/芯片贴装)工序量产工艺管控、参数调试与制程优化;
- 主导固晶工序良率提升、制程异常分析、不良根因定位及闭环改善;
- 编制、修订固晶工序工艺规范、作业指导书(SOP)、 FMEA、制程管控文件;
- 负责新产品NPI导入、物料适配验证、固晶胶/芯片基材工艺适配测试;
- 对接设备、品质、生产部门,解决量产端固晶偏移、虚焊、掉晶、气泡等工艺类不良问题。
- 学历:全日制本科及以上学历,微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先;
- 工作经验:3年及以上半导体封装测试工厂量产工作经验,熟悉半导体封装工艺流程、产线运作逻辑;
- 技能基础:熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程;能独立对接产线、研发、品质跨部门协同工作;
- 综合素质:逻辑清晰,具备独立问题排查与项目推进能力;熟悉洁净车间生产规范;可配合产线需求轮班/应急加班;熟练使用Office办公软件;
About Us
Why TI?
- Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
- We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
- Benefits that benefit you.
We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here
Learn more at TI.com .
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.
If you are interested in this position, please apply to this requisition.
About The Team
TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.
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