EMB电测技术工程师/专家（上海）

该职位来源于猎聘 Summary Of Position The Embedded PCB Specialist will drive the development of next-generation embedded PCB technologies, processes, and manufacturing capabilities. The role focuses on product development projects, qualification of new processes, materials, equipment, and automation solutions, and supporting the industrialization of advanced embedded PCB technologies. The successful candidate will serve as the technical expert for embedded component integration, failure analysis, and process optimization.

Responsibilities and Main Tasks

• Lead product development projects involving embedded component and embedded module technologies.
• Develop, optimize, and qualify new embedded PCB manufacturing processes, materials, equipment, and automation solutions.
• Design and execute DoE (Design of Experiments) to establish process capability and optimize performance.
• Analyze defect mechanisms and manufacturing issues related to embedded components and develop robust corrective actions.
• Conduct failure analysis and root cause investigations focused on embedded structures and interconnects.
• Define qualification plans and support technology transfer into manufacturing.
• Contribute to technology roadmaps and development of future embedded PCB capabilities.
• Work closely with customers, suppliers, and cross-functional teams to support development and qualification activities.
• Evaluate emerging materials, equipment, and technologies for embedded PCB applications.
• Support equipment selection, installation, and qualification for new technology developments.
• Lead technical reviews, risk assessments, and FMEA activities.
• Prepare and deliver technical presentations to customers and internal stakeholders.
• Develop technical standards, process specifications, and best practices.
• Support innovation initiatives and continuous improvement activities. Requirement：
• Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, Materials Science, Manufacturing Engineering, or related field.
• Minimum 5 years of experience in PCB technology development, process engineering, or advanced packaging.
• Strong experience with embedded component PCB technologies.
• Proven track record in process development, qualification, and industrialization.
• Extensive experience with DoE, process characterization, and statistical analysis.
• Expert knowledge of failure analysis and defect reduction methodologies.
• Experience with HDI PCB technologies;

  experience with mSAP technology is highly preferred.

• Experience with E-test of embedded PCBs is considered an advantage.

Technical Skills

• Strong expertise in PCB manufacturing processes and embedded component technologies, including HDI PCB and mSAP-based solutions.
• In-depth knowledge of embedded PCB defect modes, failure mechanisms, reliability, and yield improvement.
• Proven experience in failure analysis of embedded PCB structures using techniques and equipment such as Lock-in Thermography (LIT), X-Ray, C-SAM/T-SAM, cross-section analysis, EDX, FTIR, and microscopy methods.
• Experience in qualification of new materials, processes, equipment, and automation solutions.
• Proficiency in Design of Experiments (DoE), statistical analysis, and structured problem-solving methodologies.
• Familiarity with quality and reliability tools such as FMEA, 8D, SPC, and Six Sigma.
• Experience with E-test of embedded PCBs is an advantage.

Professional Skills

• Strong analytical, troubleshooting, and project management skills.
• Excellent communication and presentation skills with fluent written and spoken English.
• Ability to work effectively with customers, suppliers, and cross-functional stakeholders in a technology development environment.
• Self-driven, innovative mindset with a passion for developing new technologies and capabilities. Once a resume is submitted to the recruiting company, it is considered that the applicant agrees to the collection, processing, use, and disclosure of their resume and other personal information by the recruiting company for recruitment purposes. 一旦向招聘公司投递简历，即视为应聘者同意招聘公司基于招聘目的而对其简历和其他个人信息进行收集、处理、使用和披露等。