Embedding技术开发专家
Finance
奥特斯科技(重庆)有限公司
上海市, 中国¥10,000 - ¥20,000 /月2周前
全职
职位描述
该职位来源于猎聘 Responsibilities and Main Tasks:
- Develop and drive the company's technical strategy and process roadmap for COWOP, includes machine & process(method, material,chemical…) investment
- Lead the process development for multi-layer core & 30+ layer ultra-high-layer-count PCBs, solving critical manufacturing challenges such as lamination alignment, depth control for back-drilling, plating uniformity with high aspect-ratio through-holes., fine-line solution, Impedence control, stack-up warpage/coplanarity solution, reliability enhancement...etc.
- Establish and refine specialized processes, quality control standards, and test methods, elevating the overall technical competency of the team.
- Serve as the company's ultimate technical authority in key customer engagements, addressing complex challenges in state-of-the-art product designs. Requirement:
- Bachelor’s degree or higher in Electronic Materials, Microelectronics, Electrical Engineering, Mechanical Engineering, or a related field. 2. 8+ years of experience in PCB process engineering or technology development, with at least 5 years focused on PCBs for data center/server/high-end communication equipment.
- Expert in High-Layer-Count PCBs: Must have a proven track record in the mass production of 20+ layer PCBs, with in-depth knowledge and practical solutions for the challenges of 30+ layer boards
- Expert in High-Speed Materials: Thorough understanding of various high-speed/low- and ultra low-loss materials, their properties, processing requirements, and impact on reliability.
- Deep SI/PI Understanding: Ability to interpret SI simulation reports and translate electrical performance requirements (e.g., impedance tolerance ±8%, insertion loss) into precise process control parameters.
- Experience working in Nvidia supplier chain is a plus
- Excellent analytical skills for complex problem-solving and a strong foundation in Design of Experiments (DOE).
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