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Hardware Failure Analysis Engineer

Technology
新安传媒有限公司
大连市, 中国¥25,000 - ¥50,000 /月4周前截至 2026/12/11
全职

职位描述

该职位来源于猎聘 Job Description: The HEC Hardware Failure Analysis Engineer is responsible for investigating hardware failures, identifying root causes, and exploring solution to improve product reliability, quality, and repair/new made manufacturing yield. The role collaborates closely with Module engineering, manufacturing, quality, and suppliers to support parts repair, new made product development, ramp, and sustaining activities.

Key Responsibilities

  • Perform failure analysis on hardware components, assemblies, and systems to identify failure mechanisms and root causes.
  • Conduct fault isolation and data-driven root cause analysis using structured problem-solving methodologies.
  • Develop and maintain HEC test benches and failure analysis capabilities.
  • Analyze electrical, mechanical, thermal, material, and automation-related failures.
  • Support reliability testing, new repair/new made qualification, and failure investigations.
  • Partner with design, manufacturing, quality, and supplier teams to improve product robustness, manufacturability, and reliability.
  • Drive corrective and preventive actions (CAPA) to reduce field and production failures.
  • Expand HEC capabilities through technical research, innovation projects, and continuous improvement initiatives.
  • Ensure compliance with safety, integrity, and intellectual property requirements.
  • Support technical training, knowledge sharing, and capability development across teams. Qualifications:
  • Master's degree or above in Electrical Engineering, Mechanical Engineering, Materials Science, Automation, or a related engineering discipline.
  • 3 years of experience in semiconductor hardware, electronics, mechanical systems, automation, materials engineering, or related fields.

    Experience in R&D, laboratories, or research institutions is preferred.

  • Knowledge of semiconductor processes, device technologies, and quality management practices.
  • Understanding of electronic components, Mechanical design, and system-level hardware architecture.
  • Experience with failure analysis and root cause methodologies, including 8D, Fishbone, FMEA, and Fault Tree Analysis (FTA).
  • Strong analytical, communication, project management, and stakeholder management skills.
  • Self-motivated, results-oriented, and committed to continuous improvement, integrity, and safety.
  • Strong learning agility, proactive attitude in challenge environment.

    This position is for: Regular Primary Location: Dalian Additional Location(s): Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

    Work Model for this Role: This role will require an on-site presence.

    Relocation: Relocation and/or the ability to work from a different location within the country/countries posted may be available based on business need and necessary approvals.

Keywords
monthsOfExperience: 36

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