产品开发主管

该职位来源于猎聘 Duties and major activities主要职责： 1、Team Management: Responsible for establishing and refining the product development team, including recruitment, assigning roles, performance evaluations, and talent pipeline development, as well as organizing regular team meetings. 团队管理：负责产品开发小组的搭建和完善，完成人员招聘、岗位分工、绩效考核与人才梯队建设，建立小组例会。 2、Project Management: Assign product development tasks and oversee the full life-cycle of PCBA development projects (EVT/DVT/PVT). Responsible for project progress, technical solutions, BOM costs, hardware quality, and reliability metrics. Organize internal technical reviews and risk assessments, and ensure issues are resolved and closed out. 项目管理：分配产品开发任务，管控PCBA产品开发项目 EVT/DVT/PVT 全周期。对项目进度、技术方案、BOM 成本、硬件质量、可靠性指标负责。组织内部技术评审、风险评估，推动问题闭环。 3、PCBA Hardware Design: Component selection, schematic design, PCB layout and routing (multi-layer boards), and delivery of complete production documentation, including schematics, PCB layouts, BOMs, and assembly drawings.

PCBA硬件设计：器件选型、原理图设计、PCB 布局布线（多层板），输出原理图、PCB、BOM、装配图等完整生产文档。 4、PCBA Reliability, Testing, and Certification: Coordinate hardware validation solutions and conduct reliability tests, including functional testing, environmental temperature cycling, high-temperature aging, and ESD/EFT/surge testing. Lead CE/EMC compliance efforts to meet the IEC-61000 industrial standard. Produce hardware test reports and design specifications.

Familiar with high-TG board materials, high-temperature-resistant PCBA design, and component junction temperature evaluation. PCBA 可靠性、测试与认证：统筹硬件验证方案，开展功能、环境温循、高温老化、ESD/EFT/ 浪涌等可靠性测试。主导 CE/EMC 整改，满足 IEC‑61000 工业标准。输出硬件测试报告、设计规范。熟悉高 TG 板材、耐高温 PCBA 设计、元器件结温评估。 5、NPI Mass Production Rollout and Technical Issue Resolution: Coordinate with PCB and SMT manufacturers; oversee PCBA prototyping, pilot production, and mass production rollout. Troubleshoot on-site hardware failures during production and after-sales service (such as burned-out boards, communication errors, overheating, and malfunctions), conduct root cause analysis, and propose improvement plans.

NPI 量产导入与技术问题闭环：对接 PCB、SMT 加工厂，负责 PCBA 打样、试产、量产导入。处理生产、售后现场硬件故障（板卡烧毁、通讯异常、温升高、失效等），根因分析并输出改善方案。 6、Supply Chain, Localization, and Cost Reduction: Assess risks associated with key components, select alternative parts, and address material shortages. Complete the localization of hardware and reduce BOM costs while meeting the technical standards set by the German headquarters. Maintain complete archives of BOM versions, design documents, drawings, and manufacturing process documents. 供应链与国产化、降本：评估关键元器件风险、替代料选型，应对物料缺货。在满足德国总部技术标准前提下完成硬件国产化替代、BOM 降本。维护 BOM 版本、设计文档、图纸、生产工艺文件完整归档。 Requirements岗位要求： 1、Bachelor’s degree or above, in Electronic Information, Electrical Engineering, Automation, Microelectronics or a related discipline 本科及以上，电子信息 / 电气工程 / 自动化 / 微电子相关专业 2、4 years full-cycle development experience in industrial control PCBA products, with 2 years product development teams leading experience.

Have fully led projects for industrial control boards/controllers from requirements definition through to mass production. Preference will be given to candidates with experience in hardware development at German-owned industrial control companies, as well as in web guiding, tension control, motion control, lithium-ion battery equipment, and automated controllers for rubber tires. 4年以上工业工控 PCBA 完整开发经验，2年及以上产品开发团队管理经验。完整主导过工控板卡 / 控制器从需求到批量量产项目。有德资工控企业、纠偏、张力控制、运动控制、锂电设备、橡胶轮胎自动化控制器硬件开发经验优先。 3、Fluent in written and spoken English, able to communicate independently in cross-border online meetings. 英语读写流利，可独立跨国线上会议沟通。 4、Proficient in EDA software of Altium Designer, capable of independently developing industrial control main boards with 4 PCBA layers. 熟练使用EDA 软件Altium Designer，具备 4 层以上工控主板 PCBA 独立开发能力。

5、Familiar with EMC, safety, and reliability testing for industrial products, with hands-on experience in CE certification rectification. Understanding of component derating and thermal design, candidates with experience in PCBA design for components operating at temperatures of 100°C or higher over extended periods will be given priority. 熟悉工业产品EMC、安规、可靠性测试，有CE认证整改实战经验。理解元器件降额、热设计，做过元器件本体长期100℃及以上高温工况 PCBA 设计优先。 6、Proficient in DFM ((Design for Manufacturability) and DFT (Design for Test ability), and familiar with SMT assembly, environmental protection coating, and hardware mass production processes. 掌握 DFM 可制造性、DFT 可测试性设计，熟悉 SMT 贴片、三防涂覆、硬件量产工艺； 7、Familiar with IPD/PDP product development processes, with experience in hardware project cost control and a mindset focused on platform-based and modular design. 熟悉 IPD/PDP 产品开发流程，具备硬件项目成本管控、平台化模块化设计思维。 8、Candidates with PMP/NPDP certification, experience in hardware localization, and a track record of R&D collaboration with multinational companies will be given priority. 持有 PMP/NPDP、有硬件国产化替代、跨国企业研发协作优先。