封装研发总监 - 功率器件/模块

该职位来源于猎聘 I.

POSITION OVERVIEW: The Head of Package Development leads package design and technology development for BG Power packaging needs, especially for power discrete and module packages. The candidate is both a technical expert and has a track record of delivering results through his/her team. This role is particularly suited to individuals with a high level of motivation and an aptitude for pushing technological boundaries.

II.

KEY RESPONSIBILITIES: Leads and shapes the R&D BE Platform team

• Responsible for Package Technology Development/NPI with the close link to FE MOS/IGBT/SiC teams and Project Management
• Part of BG Power Project Management Board (PRB)
• Directly manages R&D BE group leaders / department managers
• Develops existing R&D BE teams both in size and competence
• Builds new teams as appropriate Oversees and directs Platform Development & Product Release
• Execution of business critical, high-profile platform and product release projects.
• Managing diverse tasks from package design and process development to testing and verification, as well as failure analysis including both discrete and module products.
• Work with multi-functional team and material vendors, qualify new package technology and material/process in a manufacturable and cost-effective way
• Owns the package process and technology roadmaps Oversees delivery of new concepts

Generate novel technology concepts

• Conduct feasibility studies on new technology concepts and process changes
• Specification of package design rules
• Assess and ensure implementation of technical improvements Subject Matter Expert on Package Technology of Power Devices
• Is sparring partner for peers inside and outside BG on technical packaging related matters III. SKILLS/COMPETENCIES Hard Skills:
• Understanding of Power MOSFETs technologies and packaging
• Experience in leading R&D teams, including managing managers.
• Knowledge and experience in design for reliability and robustness of power devices.
• Track record of in time delivery of new product and technology creation projects
• Recruit suitable technology experts from outside to meet our needs for new innovative work Soft Skills:
• Interacts effectively at all levels inside and outside the organization and across cultural boundaries
• Encourages effective team work on complex multi-disciplinary projects across multiple geographical locations
• Comfortable in delegation and leading others
• Achieves results through his teams IV. JOB SPECIFICATIONS:
• Masters’ degree and above in Microelectronics, Physics, Chemistry, Mechanical, Materials Engineering
• 15 years’ experience in package development for power semiconductor technology platform and product creation