硅光芯片设计工程师

该岗位可接受2026届应届毕业生，欢迎投递~ 岗位职责/Job Responsibility: 1、负责硅基集成光芯片的设计，能独立完成硅光芯片核心无源、有源器件的设计与迭代优化，保证性能指标达到设计要求； Responsible for the design of silicon-based photonic integrated chips (PIC); capable of independently completing the design and iterative optimization of core passive and active PIC devices to ensure that performance indicators meet design requirements； 2、能熟练使用专业芯片设计仿真工具，搭建仿真模型，完成器件仿真，结合工艺工艺特性优化芯片架构与器件参数，提升芯片整体性能与稳定性； Proficient in using professional chip-design and simulation tools, building simulation models and performing device simulation. Optimizing chip architecture and device parameters in combination with process characteristics to improve the overall performance and stability of chips； 3、负责集成光芯片版图绘制及设计规则检查，对接流片厂跟进研发、量产流片流程； Responsible for PIC layout drawing and design rule checking (DRC), liaise with foundries to follow up R&D and mass-production tape-out procedures； 4、制定芯片测试及验证方案，配合封测团队进行相关硅光芯片测试工作； Formulate chip testing and verification schemes, and cooperate with the packaging-and-testing team to carry out silicon-photonic chip-related tests； 5、负责相关技术文档的编写与归档，沉淀设计经验，做好设计项目管理工作； Compile and archive relevant technical documents, accumulate design experience, and manage design�related projects effectively。 任职要求/Job Qualification： 1、硕士及以上学历，光电子、微电子、半导体、通信相关专业优先； Master degree or above, with priority given to majors related to optoelectronics, microelectronics, semiconductors, and communications； 2、有半导体激光器、光波导器件、硅光芯片相关产品设计经验者优先； Experience in designing semiconductor lasers, optical waveguide devices, and silicon optical chips is preferred； 3.英语听说能力良好。 Good English listening and speaking skills。 注：1、工作地浙江海宁，浙江海宁提供园区单人宿舍； 2、入职当月缴纳六险一金； 3、薪资：面议。