高级结构研发工程师

Role Mission We are seeking an experienced, highly technical R&D Senior Mechanical Engineer based in Shenzhen, dedicated to the mechanical architecture, structural design and packaging of either Handheld Scanner (HHS) or Stationary Industrial Scanner (SIS) products. The role will 1. Serve as the primary technical bridge and mechanical authority between Datalogic’s mechanical R&D group and local ODMs, tooling vendors, and parts suppliers.

• Attend and facilitate the technical review of ODM designs with headquarter R&D team across all levels of mechanical detail, for both natural language and technical language perspective.
• Take technical ownership of mechanical design, structural simulation, physical prototype evaluation, and environmental/reliability verification for internal scanner projects.
• Optimize and accelerate the NPD execution process by actively utilizing the local prototyping, tooling, and manufacturing supply chain to ensure rapid project delivery. Main Responsibilities 1. Headquarters R&D Bridge &
• ODM/Supplier Technical Governance:
• Act as the direct engineering contact in Shenzhen between Datalogic’s mechanical R&D team and local mechanical suppliers, tooling houses, and ODM partners.
• Attend and facilitate the technical review with headquarter R&D on ODM 3D/2D mechanical designs, tolerance analysis and mold flow analyses to ensure full alignment with Datalogic technical standards.
• Facilitate seamless cross-border technical communication, aligning technical requirements between Italian counterparts and local suppliers, identifying technical risks early, and driving design trade-offs.
• Conduct on-site technical audits at tooling and molding facilities across China to supervise mold trials (T0/T1/T2), inspect first-article samples, and resolve tooling defect issues directly on the production floor. 2.

Internal Mechanical

Design, Simulation &

• Validation:
• Must be capable of personally designing full mechanical parts 3D/2D for either handheld or stationary industrial scanners, defining robust enclosure structures with plastic or metal, internal chassis, light pipes, mounting fixtures, and optical engine/sensor/PCBA integration.
• Conduct structural FEA simulations (dynamic drop, impact, shock, vibration) and thermal CFD analysis to predict product performance, solve structural bottlenecks, and ensure thermal stability in fanless industrial enclosures.
• Execute hands-on laboratory testing and root-cause failure analysis for physical prototypes across EVT/DVT/PVT stages, focusing on drop resistance (e.g., multi-angle drops onto concrete), tumble durability, IPxx ingress sealing, vibration, cable connection reliability test, and environmental stress.
• Integrate ergonomic requirements for handheld form factors (grip comfort, center of gravity, trigger mechanism tactile feel) and robust mounting configurations for stationary industrial devices.
• NPD Process Optimization &
• Local Supply Chain Acceleration:
• Accelerate the New Product Development (NPD) cycle by tapping into the local high-speed ecosystem for 3D printing, rapid CNC machining, fast-turn soft tooling, and rapid silicone/gasket prototyping.
• Drive rigorous DFM and DFA reviews early in the design phase to avoid costly tooling modifications and streamline production line assembly.
• Scout, qualify, and benchmark local suppliers for plastic injection molding, liquid silicone rubber, die-casting, sheet metal, elastomeric overmolding, and advanced surface finishes.
• HQ Training &
• Technical Collaboration:
• Spend an initial onboarding and training period at Datalogic’s headquarters in Italy to master proprietary mechanical design methodologies, tools, and quality standards.
• Travel regularly within China to audit supplier facilities and ensure flawless execution.
• Be continually in touch with R&D Team in Italy and in particular with the mechanical and optical teams.

Requirements Education: Bachelor’s or Master’s degree in Mechanical Engineering, Mechatronics, Material Science, or a related engineering discipline.

Language: The primary language is Mandarin. Fluent in English, both written and spoken. Must-Have (Essential Requirements):

• Mechanical Design Track Record: Minimum 7–10 years of hands-on R&D mechanical engineering experience in handheld devices, ruggedized mobile computers, stationary industrial scanners, machine vision cameras, or rugged industrial equipment.
• 3D CAD &
• Simulation Mastery: High proficiency in 3D CAD modeling software (e.g., Creo/PTC Pro-Engineer, SolidWorks, or NX) along with practical experience in structural FEA (ANSYS, Abaqus, or embedded FEA tools) and mold-flow analysis.
• Materials &
• Tooling Expertise: Deep practical knowledge of precision plastic injection tooling, two-shot/overmolding processes (e.g., PC ABS with TPU/TPE), aluminum/zinc die-casting, sheet metal, and optical window bonding.
• Rugged &
• Ingress Design: Proven track record in designing products with high IP ratings (IP65, IP67, IP68) using O-rings, custom elastomeric gaskets, ultrasonic welding, and dispensing adhesives.
• Optical Engine &
• Sensor Integration: Proven experience in the precision mechanical design of optical and vision systems. Must have direct experience defining and executing tight-tolerance mounting for optical engines, optical lens alignment/retention, anti-reflective front window tilt/angle design, and high-accuracy image sensor positioning.
• Thermal Management in Harsh Industrial Enclosures: Proven track record of designing and delivering robust thermal dissipation solutions for industrial scanning devices (especially stationary scanners). Direct experience in modeling, selecting, and implementing heat sinks, heat pipes/vapor chambers, and thermal interface materials to ensure continuous, high-reliability operation under harsh, sealed, or high-temperature factory environments.
• Supplier &
• Tooling Management: Extensive experience conducting on-site mold trials, tool tuning, Cpk/PPAP reviews, and collaborating directly with Chinese tooling vendors and ODM design teams.
• Global Collaboration &
• Mobility: Strong cross-cultural competence to interface smoothly with European engineering counterparts; willingness to travel frequently within China for supplier visits and to Italy for technical onboarding and alignment. Preferred / Nice-to-Have (Wish List):
• Basic Embedded Electronics Familiarity: Familiarity with PCBA physical constraints, rigid-flex PCB routing, board-to-board connectors, and cable harness management inside compact enclosures.
• Multinational Exposure: Prior experience working in or alongside Western multinational engineering organizations.

Technical

Competencies • Precision Mechanical Design (Must-Have): Strong foundation in tolerance stack-up analysis, kinematic fits, snap-fit mechanics, and standardized drafting practices.

• Rugged Enclosure &
• Ingress Protection (Must-Have): Comprehensive knowledge of impact energy absorption mechanics, drop survivability architectures, and high-reliability elastomeric seal designs.
• Thermal Design and Simulation (Must-Have): Proven ability to execute end-to-end thermal design and CFD simulation (FloTHERM/ANSYS) for sealed industrial scanners, optimizing heat spreading and conduction pathways across high-power computing units, illumination LEDs, and image sensors under high ambient operating temperatures.
• Optics &
• Electronics Packaging (Must-Have): Proven track record of assembling and constraining optical components, illumination modules, and multi-board PCBA architectures within precision mechanical structures, ensuring precise fit, shock resistance, and easy assembly.
• Tooling &
• Manufacturing Processes (Must-Have): Solid understanding of tool construction, slide mechanisms, gate positioning, shrinkage rates, draft angles, parting lines, and secondary finishing processes.
• Reliability Simulation (Must-Have): Proven capability to read and analyze mechanical reliability simulation results, identify structural risk points, and provide corresponding mechanical optimization proposals. Behavioral &
• Leadership Competencies • Technical Rigor &
• Analytical Mindset: Highly structured, critical, and detail-oriented approach to solving complex mechanical anomalies and evaluating supplier performance.
• Cross-Cultural Communication &
• Diplomacy: Exceptional ability to bridge technical expectations between Italian mechanical experts and local Chinese manufacturing partners.
• Proactive Problem Solving: Pragmatic, self-driven attitude capable of taking full ownership of mechanical troubleshooting both in the lab and at supplier shop floors.