封装设计工程师/专家-Package Design Engineer/Expert(J18451)

职责描述： 1.According to MRD, product performance requirements and process capability, responsible for packaging scheme selection,adopt EDA tool design PKG substrate. 2.Have ability to early PKG feasibility for new device and feedback suggestion to related department. 3.Adopt Auto CAD to design POD and wirebonding and marking drawing. 4.Adopt EDA tool design Daisy chain PKG&PCB. 5.Optimizing Bump design, develop and optimizing Ball Map. 6.Collaborated closely with the substrate factory and make new design rule can meet mass production and high performance. 任职要求： 1.Proficient in package substrate design 2.Proficient in EDA tools Candence, Zuken, etc. 3.Familiar with SIPI related high-speed PKG&PCB design requirements 4.Familiar with substrate design rule and substrate process. 5.At least 3 years experience in related industry. 6.Familar with Auto CAD etc. 7.Familar with DRAM PKG design is better. 8.Have great communication and teamwork skills. 9.Education requirement: Bachelor degree or above.