Packaging Engineer

该职位来源于猎聘 薪资面议 THE ROLE: Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement in external Wire Bond/Flip Chip Assembly/ Bumping manufacturer on delivering key performance indices in terms on yield, excursion free and enabling new capabilities.

THE PERSON: The successful candidates must have strong commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, conflict management skill, analytics & trouble shooting skill with strong interpersonal skills with good presentation skills. Good in writing and speaking in English.

Key Responsibilities

• Drive for supplier engagement on continuous improvement and new capabilities ahead of need.
• Plan and drive for New Product Introduction activities and Ramp Up readiness.
• Drive external manufacturer on issue resolution and issue prevention
• Timely execution of special work requests, with comprehensive reports.
• Monitor performance of external manufacturing site regarding yield, out of control lots disposition, and any outliers reporting from internal or external parties.
• Plan and execute change management from internal or external parties.
• Proactively drive towards continuous improvement in process simplification and quality enhancement, be it in internal and external environment.
• Occasionally to support on site audit and travelling.
• May involve in regional supplier management.
• Assist in additional duties as deemed fit by supervisor. PREFERRED EXPERIENCE:
• Strong knowledge in Flip Chip/WireBond Assembly process (while bumping/RDL process experience is added advantage)
• Track record of min 5 years of process development work leading to volume production in Semiconductor ASIC facility.
• Familiar with tools (AI agents, JMP, minitab, failure analysis knowledges, package reliability knowledges) and industry standard (ESD, Jedec, Automotive).
• Good English speaking, communication, and writing skills. ACADEMIC CREDENTIALS:
• Bachelor/MS degree in Mechanical or Material or Chemical Engineering LOCATION: Suzhou, China