Hardware Electronics Engineer
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RE: Cover Letter for Job Opportunity.
Dear Selection Committee,
As a Systems Hardware Engineer (Electronics HW Engineer) with proven track record in Embedded Electronics Engineering domain, it is with great pleasure that I tender my application to apply for a Job. In addition to my formal education and all assorted trainings as part of industrial experience makes me the perfect candidate for this opportunity in your organisation in Germany.
After over 12 years of experience with several MNCs in INDIA, I have acquired great skills which when use along with right opportunity will help me grow and be part of work force driving the German economy. I also have excellent collaboration skills and always work effectively across different teams. I’m known for being an adept consensus builder.
Ever since when I was a little kid German education system has always made me wonder, when I think about a country with such a strong educational base in my head it makes the perfect civilization I could imagine, all the German people I have met so far along with my personal research gives me the faith to believe so. Apart from my professional career and my passion towards a more evolved lifestyle my love for cars and automotive technology always takes me to Germany in my imagination. The thought of cars like BMW, Mercedes Benz and Audi on the autobahn always mesmerizes me.
The cultural diversity and open culture of Deutschland and the technologically advanced country makes this place a complete I look forward to dedicating my professional and personal life to.
With my experience and skill set, I’m confident that I can secure a good job, so that I can look forward to a Blue Card. I have already spoken to my travel agent regarding the travel arrangements and accommodation for initial few months.
In the interim, thank you for reviewing this letter and the attached material.
Sincerely,
SENIOR SYSTEMS ENGINEER – FISKER INC.
◦ Electric Vehicle Telematics, Gateway and Computation sub-system HW developmental activity.
29/10/2018 – 16/11/2022 – Bengaluru, India
SENIOR HARDWARE ENGINEER – SIEMENS TECHNOLOGY AND SERVICES PVT. LTD.
◦ Com-Express carrier high-speed board hardware design, an analytic and computation platform for Gas Chromatography System in Oil and Gas industry.
Gen3, 1000Base-T, DDR4, USB2.0 using high-end oscilloscope with in-built eye masks.
◦ 2-Wire Field Transmitter hardware development for Industrial process instrumentation.
◦ Documentation (Architecture, Module Tests, HW-HW Integration, HW-SW Integration).
◦ HW design and development tools include HyperLynx for Signal Integrity analysis.
◦ Schematic Entry using Dx-Designer, BOM Generation.
◦ Layout instruction document and PCB-Gerber Review.
◦ Testing – Board Bring-Ups, Functional Tests, Lab-view for Test Automation, Production Data
Analysis.
2/2
◦ FMEA of field transmitters, component derating, safe fail, load table preparation for explosion proof intrinsic protection concept implementation in field transmitter.
14/04/2016 – 28/10/2018 – Bengaluru, India
SENIOR TEST ENGINEER – TESSOLVE SEMICONDUCTOR PVT. LTD.
◦ Characterization of Power-MOSFET and IGBT Gate-Drive on ATE platform.
◦ Detailed test plan preparation covering all device parameters to be validated in production environment
◦ Test work-package release in production house in Malaysia.
◦ Lot qualification, test process capability analysis to meet the 6sigma quality requirements of customer.
◦ Test Time Reduction, Yield Optimization, Platform conversion.
10/09/2014 – 13/04/2016 – Bengaluru, India
HARDWARE ENGINEER – SENSEL TELEMATICS PVT. LTD.
◦ From requirement to hardware realization of Vehicle Tracking Systems for light commercial vehicles
◦ Requirement study for realizable feasibility.
◦ Hardware Architecture document, Component Engineering,
◦ Proto build and POC of VTS using off-the-shelf GNSS, GPRS modules,
Flash, SD-card, anti-theft features, analog-digital inputs and outputs for vehicle health monitor and control, GPS-GSM module with internal antennas, IP66 enclosure.
◦ Testing using lab equipments during board bring-up phase, functional testing, and IEC61000 EMIEMC
◦ EMI - EMC compliance testing of system for certified from TUV, Bangalore.
◦ Development of variants of VTS to use the products as real time location systems operated solely on battery with self-life of operation for up to 5 Years.
04/07/2011 – 06/03/2014 – Bengaluru, India
3/2
DESIGN ENGINEER – PROCESSOR SYSTEMS INDIA PVT. LTD.
◦ Learning activities to support the on-going projects encompassing building bread-board circuits of ADCs ad DACs testing the performance, board bring-ups, schematic net-list review, Layout instruction document preparation and review.
◦ Interaction with external vendor for board manufacturing and assembly activities.
◦ BOM inventory maintenance, Purchase of components
◦ Ownership of Nurse Call System feature enhancement and development project, a medical health-care system
schematic entry and layout supervision
battery powered, Zigbee protocol based systems encompassing Gateway-
Router and End_devices.
BACHELOR OF ENGINEERING IN ELECTRONICS AND COMMUNICATION
VISVESVARAYA TECHNOLOGICAL UNIVERSITY, Belagavi, Karnataka, INDIA
