Miguel Reche

Hands-on technical leader with a proven track record of leading firmware development across multiple products and chipsets, from initial design to worldwide commercialization. With broad expertise in Hardware, DSP Firmware, Protocol Stacks, Low Power Design and Wireless Systems Engineering. Consistently displays the ability to lead and give direction across multidisciplinary subsystems to solve complex issues.

MANAGING DIRECTOR at Benalcore (2026-06 – Present)

• Leading an engineering services company working on the areas of firmware engineering and electronics.

VR HW PROTOTYPING SW ENGINEERING LEAD at Meta (2022-06 – 2026-01)

• HW Prototyping SW lead for Meta Oculus VR devices.
• Lead a team of SW engineers to execute the delivery of SW solutions for our prototypes, consisting of project informers, new technology introduction platforms and platforms for Large Scale Data Collection.
• Delivered solutions across multiple subsystems, display, camera, capsense, depth sensing, eye tracking, charging, accessories, IOT tracking, FPGA camera aggregation and more.

CELLULAR FIRMWARE ENGINEER at Apple (2021-01 – 2022-05)

• Developed core wireless technologies physical layer firmware for 5G and 4G Rx Time Domain Processing.
• Owned and executed 5G and 4G Rx IQ logging functionality for performance debugging using IQ analysis.

WIRELESS CHARGING FIRMWARE ENGINEER at Apple (2018-06 – 2021-01)

• Designed and implemented the full wireless charging stack for iPhone, from the power receiver firmware to the kernel components and related subsystems.
• Architected, delivered and supported the commercialization of wireless charging for iPhone11 and iPhone12, to support up to 7.5W Qi and up to 15W MagSafe wireless chargers.

STAFF DSP FIRMWARE ENGINEER at Qualcomm (2016-11 – 2018-06)

• Led the design and development of some of the key firmware deliverables for Qualcomm's first 4G LTE C-V2X (Cellular – Vehicle to Everything) modem.
• Delivered 50% of the Firmware Design for C-V2X, designed and led the areas of TX, channel back demodulation and decode, frequency and time synchronization, RF Gain Control and calibration and led the chipset bring-up firmware team to achieve the first CV2X call.
• Coached, developed and supported graduate and junior engineers new to modem on Qualcomm's chipset architecture, DSP development tools and modem best practices.

GRAPHIC SOFTWARE ENGINEER at Intel Corporation UK (2016-01 – 2016-08)

• Led a subteam within the Linux and Android Core GPU Kernel team looking after GPU submission and performance.
• Streamlined execution, delivered GPU pre-emption and defined a framework for performance characterization of the driver.

PROGRAM LEAD / STAFF DSP FIRMWARE ENGINEER at Qualcomm UK (2010-08 – 2015-12)

• GERAN (2G) Firmware Lead for 2 generations of Qualcomm's premium tier Modem and SnapDragon chipsets.
• Led the programs and was a participant from pre-silicon to the end of commercialization with a team of engineers in the UK and US.
• Oversaw all GERAN Firmware technology subsystems and delivery of the new GERAN features for the programs.

HARDWARE VALIDATION ENGINEER/VIDEO CODECS SOFTWARE ENGINEER at 3D LABS UK (2008-02 – 2010-07)

• Worked on HW validation for ARM based chipsets, both for the ARM subsystems and for the custom-made 3D graphics, video and signal processing pipeline.
• Worked on motion estimation algorithms for the H.264 video encoder.

Telecommunication Engineering Degree in Telecommunications – Technical University of Catalonia

Master's Degree in Telecommunication Engineering in Telecommunications – UPC ETSETB TelecomBCN (2007)