Ho Man Leung

An electronic engineering graduate with first class honour. Excellent skills in developing, testing and maintaining electronic systems, including wireless communication systems and embedded software.

PIERRE D’AVOINE ARCHITECTS London

Summer internship Jun 2022 — Aug 2022

• Innovated a housing estates with new rooftop flats proposal using AutoCAD
• Collaborated with colleagues in building models for new housing design proposal and assisted in fixing the errors of the drawings

Winter internship Dec 2020 — Jan 2021

• Communicated with colleagues when preparing presentations and bill of materials for client’s meetings, for example Asia’s largest Real estate investment trust 
• Arranged procurement of material samples and ameliorated material schedules for architecture projects, including for Hong Kong Ocean Park and Link Real Estate Investment Trust 

HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE Hong Kong

Summer internship in baseband solution team Jul 2020 — Aug 2020

• Created new features for 5G base station system, for example generating resource block flag map 
• Updated specifications for Digital Signal Processing blocks of 5G base station system for most uplink and downlink channels 
• Solved Software Requirement Specification block errors to generate accurate signal-to-noise ratio, Received Signal Strength Indicator and frequency response data

Summer internship in grid solution department Jul 2019 — Sep 2019

• Created a poster and a report to introduce the usage of smart eyewear in high voltage electrical apparatuses checking and maintenance and demonstrated the usage to workers
• Revised the documentation of department’s sales and purchase orders in the past 30 years
• Assisted in preparing transformer station plan for clients

Summer Internship in Corporate Information Service Department Jun 2016 — Jul 2016

• Maintained and upgraded a corporate internal purchasing system by implementing new codes and testing the system with different cases
• Evaluated and debugged the corporate internal purchasing system to assure its quality

THE CHINESE UNIVERSITY OF HONG KONG (QS Ranking 38) Hong Kong

Bachelor of Engineering in Electronic Engineering Sept 2016 – Aug 2021

• GPA: 3.67/4.00 (equivalent to First Class Honour)
• Scholarship: HSBC Innovation and Technology Scholarship; Charles Kao Scholarship; Simatelex Charitable Foundation Scholarship
• Major Courses: Final Year Project(Wireless Tech) — Grade A, Introduction to Power Electronics – Grade A-, CMOS Digital IC Design — Grade A, Analog Integrated Circuit — Grade A-, Microelectronic Devices and Circuits — Grade A-, Business Sustainability – B+

Engineering Program (Exchange) Sept 2019 – Aug 2020

• Major Courses: Data Structures and Algorithms – Grade 1, Digital and Wireless Communication – Grade 2.1, RF Engineering and Application Electromagnetics — Grade 2.1