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IC Product Engineer

Technology
חברה בתחום אחר
תל אביב יפו, ישראללפני 2 חודשים
משרה מלאה

תיאור המשרה

We are seeking an IC Product Engineer to drive silicon validation, yield optimization, and product maturity from initial tape-out through high-volume manufacturing. In this role, you will act as the technical bridge between Design, Test, Quality, and Foundry/OSAT partners. Youll leverage advanced statistical analysis to convert complex ATE data into actionable yield and quality improvements.ng requisitions 'from scratch'ResponsibilitiesYield Learning &

  • Optimization: Drive wafer-level and final test yield enhancement programs. Identify root causes of yield drop, parametric shifts, and low-yield excursions across multiple manufacturing lots.Data Analysis &
  • Reporting: Use JMP, Spotfire, or similar statistical tools to analyze large-scale ATE data (STDF), perform correlation analysis, establish guard bands, and track yield metrics across OSATs and foundries.Silicon Validation &
  • Characterization: Partner with Design and Test teams to define characterization plans, perform shmoo plot analysis, evaluate thermal/voltage margins, and establish production test limits.Production &
  • OSAT Support: Support offshore manufacturing, review yield baseline shifts, drive continuous improvement programs (CIP), and manage product hold disposition rules.Quality &
  • Reliability: Assist Failure Analysis (FA) and Reliability teams in investigating customer returns (RMA), qualifying new packages/process nodes, and supporting ESD/HTOL/HAST qualification tasks.Requirements: RequirementsExperience: Minimum 5 years of direct experience in IC/Semiconductor Product Engineering (post-silicon bring-up to high-volume production).Statistical Tools: Demonstrated hands-on proficiency with JMP, Spotfire, or equivalent statistical data analysis engines for handling STDF/wafer map data.Yield &
  • Parametric Analysis: Deep understanding of statistical process control (SPC), baseline drift detection, capability metrics (Cpk ), and correlation methodologies (wafer vs. package test).Education: Bachelors or Masters degree in Electrical Engineering, Computer Engineering, Microelectronics, or a related field.Preferred QualificationsTest Engineering Background: Direct experience with Automated Test Equipment (ATE) platform hardware and test program development (e.g., Advantest V93000, Teradyne Ultraflex).Foundry &
  • OSAT Interface: Familiarity with fab processes, PCM/WAT data, and packaging assembly flows.Automation: Proficiency in scripting for data extraction and automation (Python, PERL, Tcl, or JMP JSL).This position is open to all candidates.
Keywords
BaselinePerlPythonTclSpotfireNode

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