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IC Product Engineer

Technology
חברה בתחום אחר
תל אביב יפו, ישראללפני חודש
משרה מלאה

תיאור המשרה

We are seeking an IC Product Engineer to drive silicon validation, yield optimization, and product maturity from initial tape-out through high-volume manufacturing. In this role, you will act as the technical bridge between Design, Test, Quality, and Foundry/OSAT partners. Youll leverage advanced statistical analysis to convert complex ATE data into actionable yield and quality improvements.ng requisitions 'from scratch'ResponsibilitiesYield Learning &

  • Optimization: Drive wafer-level and final test yield enhancement programs. Identify root causes of yield drop, parametric shifts, and low-yield excursions across multiple manufacturing lots.Data Analysis &
  • Reporting: Use JMP, Spotfire, or similar statistical tools to analyze large-scale ATE data (STDF), perform correlation analysis, establish guard bands, and track yield metrics across OSATs and foundries.Silicon Validation &
  • Characterization: Partner with Design and Test teams to define characterization plans, perform shmoo plot analysis, evaluate thermal/voltage margins, and establish production test limits.Production &
  • OSAT Support: Support offshore manufacturing, review yield baseline shifts, drive continuous improvement programs (CIP), and manage product hold disposition rules.Quality &
  • Reliability: Assist Failure Analysis (FA) and Reliability teams in investigating customer returns (RMA), qualifying new packages/process nodes, and supporting ESD/HTOL/HAST qualification tasks.Requirements: RequirementsExperience: Minimum 5 years of direct experience in IC/Semiconductor Product Engineering (post-silicon bring-up to high-volume production).Statistical Tools: Demonstrated hands-on proficiency with JMP, Spotfire, or equivalent statistical data analysis engines for handling STDF/wafer map data.Yield &
  • Parametric Analysis: Deep understanding of statistical process control (SPC), baseline drift detection, capability metrics (Cpk ), and correlation methodologies (wafer vs. package test).Education: Bachelors or Masters degree in Electrical Engineering, Computer Engineering, Microelectronics, or a related field.Preferred QualificationsTest Engineering Background: Direct experience with Automated Test Equipment (ATE) platform hardware and test program development (e.g., Advantest V93000, Teradyne Ultraflex).Foundry &
  • OSAT Interface: Familiarity with fab processes, PCM/WAT data, and packaging assembly flows.Automation: Proficiency in scripting for data extraction and automation (Python, PERL, Tcl, or JMP JSL).This position is open to all candidates.
Keywords
BaselinePerlPythonTclSpotfireNode

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