오늘 업데이트된 대한민국의 packaging engineering 채용 기회 3건
건의 채용 공고
Company: Qualcomm Korea YH Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: Role Overview We are looking for a highly motivated Packaging Engineer capable of leading state-of-the-art advanced IC packaging development and new product introduction of leading-edge
Company: Qualcomm Korea YH Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: Qualcomm Packaging group is responsible for developing new package technologies and high-volume manufacturing deployment for different product segments for mobile market & new emerging
Company: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: Job Overview: Qualcomm Packaging group is responsible for developing new package technologies and high-volume manufacturing deployment for different product segments for mo
₩88,935,000 – ₩141,380,000/año
추정 신뢰도: Low
시장 데이터 기반 추정치입니다. 실제 급여는 경험, 기업 및 위치에 따라 다를 수 있습니다.
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