Harveend Ganesan

I would like to express my interest in applying for an Equipment Engineer position in your company. I am currently working at TF-AMD as an Equipment Engineer, with nearly one year of experience in Advanced Packaging. I am seeking new opportunities to broaden my experience and further develop my skills in a new and challenging environment.

Kindly review my attached resume for your consideration. I would be grateful for the opportunity to attend an interview at your convenience.

Thank you for your time and consideration. Have a pleasant day.

TF.AMD SDN. BHD, MALAYSIA. Jun 2025 – Feb 2026

• Position: Equipment Engineer
• Die Attach Machine (Face up, Face Down, Wafer to Wafer)

o Responsible for maintaining and improving die bonding performance.

o Performs daily monitoring on incoming vacuum and CDA at machine gauge.

o Ensure the machine operation to move the source and target wafer loading and unloading processes.

o Ensured all pick and place tooling including Ejector, Sorter, Precisor, Flipper, Flux tray,

Scrapper and bond head were maintained and stored in dedicated tooling tray in optimal working condition to support stable and efficient machine performance.

o Developed and comprehensive preventive maintenance schedule for technicians,

covering Daily, Week, Month, Semi Annual and Annual maintenance task to ensure consistent equipment reliability and performance.

o Conducted inspection and replacement of wear and tear components to prevent equipment downtime and sustain machine performance.

o Performed machine calibration activities using calibration jigs, including Ejector level adjustments, sorter level adjustments, Precisor stage leveling, three-point straightline calibration (Camera, Sorter, Ejector), Bond head flatness verification, Bond Force check within the spec and chuck table flatness alignment to ensure precise die attach accuracy.

o Maintain safety features, including emergency switches and safety doors and conducted dry run wafer to check particles in machines.

o Configured machine parameters, including die size, adhesive type (Die Attach Film,

solder bump), bond force, placement speed and bond head temperature.

o Monitored critical parameters such as bond force, pick and place accuracy, die tilt, and alignment to ensure precise assembly.

o Prepared and completed essential machine documentation including FMEA, machine spec, OCAP and Work Instruction.

• Bachelors in Electronics Technology Engineering (Computer and Communication),

University Tun Hussein Onn Malaysia (UTHM), Malaysia, 2020

• Diploma in Electrical and Electronics Engineering, Polytechnic Sultan Azlan Shah

(PSAS), Malaysia, 2016