Hock Fu Lim

I am Lim Hock Fu, born 1998. In April 2022, I have completed my Bachelor of Engineering in New Energy Science and Engineering (NESE) in Xiamen University Malaysia. Worked in NXP semiconductor as R & D engineer.

I started of my career advancement with NXP Semiconductor company. I work as packaging engineer in Assembly Package Innovation team (R&D department. Mostly handling Backend Process of chip packaging such as mold, ball bump, laser mark, singulation and visual inspection (ICOS) process. I will also carry out design of experiment for new product and troubleshooting each process to ensure a robust recipe.

In April 2022, I have completed my Bachelor of Engineering in New Energy Science and Engineering (NESE) in Xiamen University Malaysia. Mostly involve in renewable energy sector to cater for future green energy