Kanesh Warren

Overall 8 years of experience in the semiconductor industry with strong technical skills and engineering skill sets. Process development engineer in Nexperia Sdn. Bhd for Die attach and wire bond process. Role and responsibilities will be mainly on process improvement, cost-savings, quality improvement, risk mitigation, capacity ramp up & new product introduction.

• Process Development in Die attach & Wire bond process
• Process improvement, Cost saving, Quality improvement, Risk mitigation, Capacity ramp-up
• New product introduction 
• DoE designing for the feasibility study of development projects and executing in the production
• Hands on the equipment both die attach & wire bond
• Data collection and analyze (SPC, Minitab)

Bachelor's Degree in Mechanical Engineering (Hons)

University of Sunderland, Segi College Subang Jaya

CGPA: First Class Honors

Duration: Sept 2017 - Dec 2020