Yee Chuok Gan

I am looking an engineer job placement in Singapore.

STMicroelectronics | Johor

Package Development Engineer April 2022 – April 2023

• Supported R&D Muar plant in terms of molding and grinding process for project of Panel Layer Packaging (PLP) and Laser Induced Strip Interconnect Package (LISIPack).
• In charge of executing Design of Experiment (DOE) of molding to define optimum process parameter to counter external voids, bleed, incomplete fills, and warpage. 
• Involved in customer sample build (5x5 QFN), mold trial execution, process buyoff, and machine part conversion (included TOWA PMC2030S & Disco Grinding Machine). 
• Frequently dealt with resin suppliers in terms of material customization, purchase, and timely shipment to ensure availability of materials along the projects.
• Cooperated with R&D department from Italy division to define process specification and in-process control (IPC).
• Well-known in Scanning Acoustic Microscopy (SAM), including creating recipe, checking defects (delamination, internal voids, and gel particles), and interpreting structures layer by layer inside the package. 
• Assisted in plasma (contact angle), post mold cure (PMC), ultraviolet cure and detape, X-ray inspection, Cyberscan (Symphony), and 3D optical profilometer (Sensofar).

Intern in Engineering Department January – August 2019 

• Implemented Kaizen improvements in assembly line, including kitting trays renovation, checking jig building, and workstation improvements to diminish missing part issue.
• Analyzed data on quality specifications to tackle issues of bending and flatness after stamping process.
• Created and renewed standard operating procedures (SOP) and checklists in assembly line for clients auditing and reviewing purpose.

University Technology Malaysia (UTM) | Johor October 2020 – March 2022

• Master’s Degree in Business Administration, major in Strategic Management 
• CGPA: 3.91 / 4.00 | Good Pass

• Bachelor’s Degree in Mechanical Engineering, major in Product Technology 
• CGPA: 3.42 / 4.00 | Second Upper Class