STMicroelectronics | Johor
Package Development Engineer April 2022 – April 2023
- Supported R&D Muar plant in terms of molding and grinding process for project of Panel Layer Packaging (PLP) and Laser Induced Strip Interconnect Package (LISIPack).
- In charge of executing Design of Experiment (DOE) of molding to define optimum process parameter to counter external voids, bleed, incomplete fills, and warpage.
- Involved in customer sample build (5x5 QFN), mold trial execution, process buyoff, and machine part conversion (included TOWA PMC2030S & Disco Grinding Machine).
- Frequently dealt with resin suppliers in terms of material customization, purchase, and timely shipment to ensure availability of materials along the projects.
- Cooperated with R&D department from Italy division to define process specification and in-process control (IPC).
- Well-known in Scanning Acoustic Microscopy (SAM), including creating recipe, checking defects (delamination, internal voids, and gel particles), and interpreting structures layer by layer inside the package.
- Assisted in plasma (contact angle), post mold cure (PMC), ultraviolet cure and detape, X-ray inspection, Cyberscan (Symphony), and 3D optical profilometer (Sensofar).
Allied Precision Manufacturing Sdn Bhd | Johor
Intern in Engineering Department January – August 2019
- Implemented Kaizen improvements in assembly line, including kitting trays renovation, checking jig building, and workstation improvements to diminish missing part issue.
- Analyzed data on quality specifications to tackle issues of bending and flatness after stamping process.
- Created and renewed standard operating procedures (SOP) and checklists in assembly line for clients auditing and reviewing purpose.
