Package / Process Development Engineer

Job description

• Lead R&D initiatives focused on die preparation processes like but not limited to laser groove / ablation, mechanical dicing, stealth dicing.
  • Collaborate with cross-functional teams to drive innovation and integrate new process technologies.
  • Design and conduct experiments to develop and refine packaging processes.
  • Analyze experimental data to identify trends and optimize process parameters.
  • Develop comprehensive process documentation and control plans.
  • Address and resolve complex process-related challenges.
  • Stay abreast of the latest advancements in semiconductor packaging and incorporate cutting-edge techniques.
  • Mentor and provide technical leadership to junior engineers and team members.
  • Ensure all R&D activities comply with industry standards and company policies.onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.More details about our company benefits can be found here:https://www.onsemi.com/careers/career-benefitsWe are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.