Jullian Moriel Aznar

Manufacturing Engineer with hands-on experience in semiconductor front-end-of-line (FOL) wafer back grinding operations at Amkor Technology Philippines. Equipped with TESDA NC II certification in Semiconductor Front-of-Line Operations, Lean Six Sigma White Belt, and practical knowledge of SPC, DOE, and structured problem-solving methods (5 Whys, 8D, OCAP). Proficient in MES/eCIM/eMES engineering systems and customer-specific quality documentation.

Seeking a process or product engineering role in semiconductor manufacturing where technical expertise and a continuous improvement mindset can drive real impact.

Administrative Assistant IV – Office of the Deputy General Manager - Philippine Retirement Authority - Makati City

(2024-09)

• Provided executive-level administrative support, managing high-volume records and ensuring data accuracy and efficient document retrieval.
• Maintained structured file tracking systems covering sensitive information, urgent document processing, approval coordination, and inter-departmental distribution.
• Prepared reports, tracked operational data, and coordinated with multiple departments to ensure timely completion of tasks and compliance with government procedures.

Inventory Officer – Telecommunications Distribution - Iridium Technologies (Headway Inc.) - Quezon City

(2024-02 - 2024-07)

• Maintained strict daily inventory accuracy by aligning manual physical counts with SAP system records, ensuring zero discrepancies across high-value and slow-moving units.
• Implemented a structured cycle-counting routine supervising stockmen on a randomized schedule, ensuring consistent compliance with 5S standards and accuracy procedures.
• Generated daily and weekly inventory reports including sales summaries, stock status, and workforce tracking; managed inter-warehouse stock transfers via SAP.

Apprentice Process Engineer – Front-End-of-Line (FOL) | Wafer Back Grinding Process - Amkor Technology Philippines, Inc. - Muntinlupa City

(2023-05 - 2023-10)

• Performed FOL wafer back grinding operations in a high-precision semiconductor manufacturing environment, ensuring compliance with strict quality and safety standards.
• Conducted incoming wafer inspections, taping, grinding, de-taping, and outgoing inspection, identifying defects such as chipping, contamination, and warpage.
• Executed process evaluations including roughness, thickness, warpage, and DAF offset assessments; contributed to PLS qualifications and authored 2 work instructions.
• Performed PE evaluations involving DAF and ring centering and machine assessments, including equipment certification on the PG3000RMX back grinding machine.
• Utilized engineering tools — eMES, eCIM, WIP Console, WMLS — for lot monitoring, process tracking, and wafer map data management.
• Generated customer-specific defect documentation: MRB, DMR (Texas Instruments), WQR (MAXIM), DCD (Analog Devices), IQA, and ONSEMI reports.
• Applied structured problem-solving methods including 5 Whys, 8D, and OCAP to support yield improvement initiatives and corrective actions.

Bachelor of Science - Manufacturing Engineering - Mapúa University (2017 - 2022)