Dambar Ale

Highly experienced Semiconductor Manufacturing Operator with 11 Years (Jan 2013 - Jan 2024) of continuous service at ASEM - Advanced Semiconductor, Malaysia - World's No.1 OSAT company. Expert in Icon Pro & Icon Plus Wire Bonder machines for IC Chip internal wire bonding (Gold & Copper wire). Proven track record in cleanroom production, zero-defect quality, and high-volume manufacturing.

Seeking Wire

Bonding / Semiconductor Operator role in Europe (Hungary, Poland, Germany, Portugal).

Manufacturing Operator - Wire Bonding Department at ASEM - Advanced Semiconductor Electrics, Malaysia (2013-01 – 2024-01)

• Operated and managed Icon Pro & Icon Plus (Shinkawa / ASM) fully automatic wire bonder machines
• Performed Gold & Copper wire bonding on IC chips inside cleanroom ISO Class 5/6 environment
• Achieved consistent high UPH (Units Per Hour) with less than 0.1% defect rate
• Machine setup, calibration, conversion, daily maintenance and troubleshooting
• Visual inspection under microscope, bonding quality check (Ball shear, Wire pull test)
• Followed strict ESD, 5S, Kaizen and Cleanroom protocols
• Trained 15+ new operators on Icon Pro/Plus operation
• Worked in 12-hour shifts, handled high-volume production targets

Shree public high schools Dharan