Micron Semiconductor Asia Ops Ptd Ltd
Procurement Category Supplier Manager Mar’22 - Present
Key accomplishments
Sept’23 – Current
- Achieved savings target for assigned Assembly (Wafer Prep) and PWF areas
- Established Category Strategy for assigned Assembly Area (Wafer Prep)
- Established Agreement with Supplier on Volume Purchase Agreement and Business Award for new Equipment models
Mar’22 – Aug’23
- Developed Category Strategy for assigned Assembly Area (Bonding)
- Achieved savings target for assigned Assembly Area (Bonding)
- Supported business needs of PO cancellations and pushing out cashflow without any liability
Responsibilities
- Supplier Sourcing & Selection (New TOR, HVM Spend)
- Category Strategy through Spent Analysis & Cost Saving management
- Stakeholder management
- Supplier Performance management
NPI Senior Engineer May’20 – Feb’22
Package Development Senior Engineer May’18 – April’20
Key accomplishments
- Supported and enabled the successful startup of Assembly Pilot Line in Penang during 2021 Covid period
- Enabled successful qualification and implementation of alternate sourced materials for cost saving project
Responsibilities
- Develop and qualify process and package technology for new product implementation in Assembly Wafer Preparation Operations
- Support new package development projects
- Support projects to improve cost savings on In-Direct Material on Assembly packaging
- Perform Process CZ for new package development (Flip Chip Controller)
Assembly Process Engineering Lead Jan’17 – April’18
Assembly Process Engineer May’14 – Dec’16
Key accomplishments
- Successfully in managing a team of Junior Engineers and Engineering Assistants to be capable of handling daily process issues
- Enabled qualification and implementation of process improvement activities
Responsibilities
- Process Lead for Assembly 2 Wire Bond Operation
- Process Owner/Lead for Assembly Wafer Preparation Operations
- Owner for FMEA/QCP and SPC for Assembly Wafer Preparation / Wire Bond
- Process Yield, Quality and Cycle time for matured products.
- Process Lead for alternate piece part evaluations and qualifications
- Process Lead for Product Integration into HVM
- Team Leader for GDM closure on Excursion and MRB events
- Facilitator for MSB Assembly KPI and CMP review
