Ivan Chng

Local Singaporean Profressional that have been working in the Semiconductor Backend Assembly since 2014 to current.

Micron Semiconductor Asia Ops Ptd Ltd

Procurement Category Supplier Manager Mar’22 - Present

Key accomplishments

Sept’23 – Current

• Achieved savings target for assigned Assembly (Wafer Prep) and PWF areas
• Established Category Strategy for assigned Assembly Area (Wafer Prep)
• Established Agreement with Supplier on Volume Purchase Agreement and Business Award for new Equipment models 

• Developed Category Strategy for assigned Assembly Area (Bonding)
• Achieved savings target for assigned Assembly Area (Bonding)
• Supported business needs of PO cancellations and pushing out cashflow without any liability

• Supplier Sourcing & Selection (New TOR, HVM Spend)
• Category Strategy through Spent Analysis & Cost Saving management
• Stakeholder management
• Supplier Performance management

Package Development Senior Engineer May’18 – April’20

Key accomplishments

• Supported and enabled the successful startup of Assembly Pilot Line in Penang during 2021 Covid period
• Enabled successful qualification and implementation of alternate sourced materials for cost saving project

• Develop and qualify process and package technology for new product implementation in Assembly Wafer Preparation Operations
• Support new package development projects
• Support projects to improve cost savings on In-Direct Material on Assembly packaging
• Perform Process CZ for new package development (Flip Chip Controller)

Assembly Process Engineer May’14 – Dec’16

Key accomplishments

• Successfully in managing a team of Junior Engineers and Engineering Assistants to be capable of handling daily process issues
• Enabled qualification and implementation of process improvement activities

• Process Lead for Assembly 2 Wire Bond Operation
• Process Owner/Lead for Assembly Wafer Preparation Operations
• Owner for FMEA/QCP and SPC for Assembly Wafer Preparation / Wire Bond
• Process Yield, Quality and Cycle time for matured products.
• Process Lead for alternate piece part evaluations and qualifications
• Process Lead for Product Integration into HVM
• Team Leader for GDM closure on Excursion and MRB events
• Facilitator for MSB Assembly KPI and CMP review

Nanyang Technological University Aug’’08 – July’11

• Bachelor Degree in Mechanical Engineering

• Diploma in Business Process & System Engineering