Jing Ning Yap

Experienced engineer skilled in quality control, process improvement, and problem troubleshooting in the semiconductor and rubber manufacturing fields. A quick learner who excels in high-pressure, multi-tasking environments with strong interpersonal communication skills. Possesses a self-motivated work ethic and ability to work independently and in teams.

Micron Semiconductor Asia Pte Ltd

Nov 2022 – Feb 2023.

Processes And Equipment Engineer

• Deployed Chemical Mechanical Planarization (CMP) Module equipment and Semiconductor manufacturing process.
• Classified wafer defects from wafer map pattern.
• Performed root cause analysis and identified appropriate solutions for production.
• Monitored process performances with statistical process control (SPC).
• Optimized break-in and polishing recipe for reducing wafer defects by 20%.
• Improved process by introducing cost saving material and new technology.
• Planned and monitored on project plan, project monitoring and project reporting.

University Technology Petronas

Sept 2018 – Aug 2022.

• Bachelor of Chemical Engineering.
• First Class Honours with 3.80/4.00 CGPA