M Pavan Kumar

Works on die temperature sensor (DTSR) analysis for printheads design. Wafer level e-testing and pen level electrical testing and data analysis for results. Working on LDO design for maintaining output as supply for firing line for printheads.

Analog circuit and product development engineer - Hewlett Packard (HP) - Singapore

(2024-01)

• Works on die temperature sensor (DTSR) analysis for printheads design.
• Wafer level e-testing and pen level electrical testing and data analysis for results.
• Working on LDO design for maintaining output as supply for firing line for printheads.

Analog/Rf circuit design engineer - Halo microelectronics - Singapore

(2023-07 - 2023-12)

• Worked on DC-DC Buck converter design.
• Worked on oscillator and amplifier modification and block level simulation.

Analog and Mixed signal circuit design - Infineon technologies - Singapore

(2021-06 - 2023-06)

• Analog design and top-level analog block verification.
• Low power and low voltage design of bandgap with 5mv variation across PVT which gives vdd/2 as output in 65nm and 180nm technology with trimming circuit.
• PMOS and NMOS LDO design for low voltage and low dropout voltage in 180nm technology.
• Cacsode NMOS LDO design for high psrr for using in PLL blocks.
• Low current pmos and nmos input op-amp circuit design.
• Constant-gm circuit design for LNA applications.
• Buck converter circuit design where output acts as a supply for PMOS LDO and Bandgap.
• Charge pump circuit medication and design verification.
• Analog design verification for PMS blocks such as bandgap, oscillator and regulators.
• Worked on Validation of DTSR using C# and MATLAB coding styles.
• Analog block verification of digital voltage monitors and oscillators using cadence tools.

Master of Science - INTEGRATED CIRCUIT DESIGN - Hong Kong University of Science and Technology (HKUST) (2020 - 2021)

Bachelor of Technology - Electronics and communication engineering - Hindustan Institute of Science and Technology, India (2014 - 2018)