Tan Wei Sheng
Manufacturing Engineer
Talent
SingaporeMember since August 13, 2023
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About
I would like to work in an organized environment where I can be challenged to perform and be recognized for my performance. I’m a team player that is able to work in a team with various kind of people. Besides, I’m a willing,fast learner and an optimistic person who always looks for the good in every situation
Experience
Industry Trainee at Cypress Semiconductor (Malaysia) Sdn. Bhd.
July 2020–September 2020
- Introduction to layout design by using Cadence virtuoso software
- Final Year Project (Area optimization of active reference band gap amplifier) floor planning
- Cypress Traineeship program provided laptop for industry trainees to complete final year project by using Cadence Virtuoso software
Physical Verification Sign-Off Engineer at Mediatek (Singapore)
Dec 2021 – Jun 2022
- Responsible for Full-chip Physical Verification Sign-off in the area of (DRC, ANT) for tape-out
- Implement automation scripts in C-shell and Perl Develop layout implementation flow and physical verification flow
- Co-work with QA team to reduce the PDKs/Rule deck defects
- Co-work with PDK team to code and maintain DRC/ANT rule deck for various processes
Equipment Engineer at Micron Semiconductor Asia Pte. Ltd. (Singapore)
Jul 2022 – Present
- Responsible for planning, scheduling, and implementing new tool installations, relocations, and chamber retrofits.
- Own and develop equipment maintenance procedures and schedules
- Work with the process owners to develop, prioritize and manage projects to reduce defects, improve availability and find solutions to ongoing problems; and identify, quantify, and qualify cost reduction projects
- Serve as the liaison between facilities, vendor reps, and shift personnel
- Interact with process owners and tool vendors to develop new hardware, software, and technologies related to process and hardware performance improvements
Education
Diploma in Microelectronic Engineering at University Malaysia Perlis (UniMAP)
June 2015 - March 2018
B.Eng.(Hons) in Microelectronic Engineering at University Malaysia Perlis (UniMAP)
Sep 2018 - Aug 2021