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BMC系統硬體工程師

Technology
ASPEED Technology
新竹市, 台灣1個月前截至 2026/5/14
全職

職缺描述

Job Description

  1. 熟悉PCH架構與伺服器主機版硬體開發與設計
  2. 設計IC驗證系統以及協同IC designer, SW designer 驗證IC功能
  3. 熟悉 BMC Interface such as LPC/eSPI ,RGMII,I2C,I3C,SPI,USB, DDR4 interface protocol and timing spec.
  4. 撰寫 technical document for customer reference
  5. 協助客戶系統硬體線路設計, Schematic review,和PCB layout review.(include on side support bring up system)
  6. 設計自動化IC驗證系統硬體與協助IC量產( 熟悉 Python language)
  7. 解決客戶端工程問題

Must-have:

  1. Major in EE or related fields.
  2. Has strong passion of building a great product.
  3. Self-motivated, goal-oriented and always looking for improvement.
  4. Ability work independently for IC validation system design (from circuit design, components survey, PCB layout review, SI simulation, components purchase and PCB SMT)
  5. Familiar with high speed circuit design and PI analysis. (LPDDR4, USB3,SATA, PCIe)
  6. Familiar with OrCAD, Allegro design tool.
  7. Enough knowledge for SI simulation for high speed circuit design (Ex. Siwave or HFSS)
  8. Experience in x86/ARM based server platform design.
  9. Familiar with Python and C language for automation validation development.
Keywords
LpcMysqlPythonOrCADAllegroHfssPcb

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