Senior Engineering & Management Professional
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19+ Years of Engineering & Management Experience across Semiconductor, Advanced Packaging, Wafer Processing, Micro LED, and VCSEL/Solar PV industries.
Executive & Team Leadership with cross-functional engineering teams of up to 32 direct reports (Service Engineers & Product Specialists). Expertise in developing strategies for equipment service/parts contracts and negotiation strategies that consistently achieved and exceeded after sales & service revenue targets.
SR. TECHNICAL SUPPORT & APPLICATION ENGINEER at SYFT TECHNOLOGIES.CO (2021-04 – Present)
Company specializes in direct mass spectrometry (MS), providing real-time trace gas analysis by SIFT-MS technology.
LEVEL2 - SR. ENGINEER at AIXTRON AG. (2018-08 – 2020-10)
Aixtron SE is a German-based European technology company which specializes in manufacturing MetalOrganic Chemical Vapor Deposition (MOCVD) equipment for clients in the semiconductor/LED/Photoelectric and optical related industry. Product/Project: MOCVD (G4TM/G5+).
SERVICE & OPERATION MANAGER at BE SEMICONDUCTOR INDUSTRIES N.V. (BESI) (2016-11 – 2018-06)
Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, computer, automotive, industrial, LED and solar energy. Product/Project: Die Attach: Datatcon & Esec Die bonding/Wire bond; Packaging: Fico Molding; Trim & Form/Singulation system and Plating.
REGIONAL SERVICE & OPERATION MANAGER at MEYER BURGER (M.B.) TECHNOLOGY GROUP (2009-04 – 2011-09)
Meyer Burger is a global technology company specializing in innovative systems and processes based on semiconductor technologies and is employing around 1,500 people across three continents.
Burger focus is on photovoltaics (solar industry) while their competencies and technologies also cover important areas of the semiconductor and the optoelectronic industries as well as other selected high-end markets based on semiconductor materials.
Product/Project: Depx-2400
• PECVD
• Sina/MAiA
• PECVD
• CAMMINi Firing System
• DS-271 Multicrystalline Slicing System Hennecke Wafer inspection system.
FIELD SERVICE ENGINEER at A.S.M. TECHNOLOGY LTD. (2006-09 – 2009-03)
ASM is a supplier of semiconductor process equipment for wafer processing; specializing in Plasma Enhanced Atomic Layer Deposition (PEALD); Atomic Layer Deposition (ALD); also pioneered important aspects of many established wafer-processing technologies used in industry, including lithography, deposition, ion implant and single-wafer epitaxy. Product/Project: ALD; PEALD; LPCVD; (Low pressure chemical vapor deposition and diffusion); PECVD.
ASSISTANT QC ENGINEER at KUAZUI MOTORS, LTD. (2002-07 – 2006-07)
Product/Project: Toyota Camry, Altis, Wish. Primarily focused on new project (car/parts) qualifications. Responsible for the production line inspection SOP/document building, and new vendor qualifications.
Bachelor of Science in Electro-Mechanical Engineering – TAMKANG UNIVERSITY
Diploma in Department of Marine Engineering – CHINA JUNIOR COLLEGE OF MARITIME TECHNOLOGY