Anson Kuo

Mechanical System Architect and technical leader with 16+ years of hands-on experience designing and delivering complex electro-mechanical products from concept through high-volume mass production. Deep expertise in plastic injection-molded enclosures, sheet-metal structures, tolerance analysis / GD&T, DFM/DFA, tooling development, and Design-to-Cost for commercial and consumer hardware platforms. Proven track record leading end-to-end mechanical architecture for high-volume products (HP Commercial AiO, Philips TVs, ASUS monitors), driving cost reduction, manufacturability, and production readiness while collaborating with global ODMs, suppliers, and cross-functional engineering teams.

Senior Mechanical Engineer at KEENFINITY Group (IQSIGHT – Formerly Bosch Video Systems) (2025-05 – Present)

Own mechanical engineering for complex commercial surveillance platforms (FLEXIDOME multi+ 7100i IR), resolving system integration, assembly, and sample validation challenges across structural, thermal, and manufacturing domains.

• Led rapid product development and manufacturing execution; drove C1 pilot production build in Thailand to completion within three months of project engagement.
• Provided technical leadership to joint-development ODM partners through C2 and D pilot builds, driving design improvements, defect resolution, and high-volume mass-production readiness.
• Collaborated with global cross-functional engineering and manufacturing teams to identify root causes and implement robust mechanical design modifications supporting production stability.

Mechanical Team Leader / Principal Engineer at Inventec Corporation (2021-12 – 2025-04)

Led mechanical architecture and end-to-end product development for flagship HP 2025 Commercial AiO platforms, owning system-level solutions from concept definition through design, validation, NPI, and mass production.

• Defined system-level mechanical architecture balancing structural rigidity, thermal constraints, cost, manufacturability, reliability, and sustainability across chassis, materials, and tooling.
• Drove Design-to-Cost and weight optimization, delivering 25% weight reduction on the AiO G9 chassis base pan while achieving approximately US$0.40/unit direct material cost savings; executed additional ~US$0.03/unit reductions through material and process optimization.
• Introduced 85% PCR + 5% OB-EPS sustainable material solution into production-ready components; partnered with HP HQ, electrical, industrial design, thermal, manufacturing, tooling, and ODM teams to align technical trade-offs and secure the winning bid (Intel Arrow Lake platform).
• Provided technical direction across multiple development programs and served as key interface between engineering, suppliers, and manufacturing operations for high-volume production readiness.

Lead Mechanical Engineer at TPV Technology Co., Ltd. (Philips TV – OBM) (2013-03 – 2019-08)

Led mechanical design and architecture for large-format Edge-LED and Direct-LED TV platforms (49"–65"), owning structural architecture, plastic chassis, sheet-metal parts, tooling development, and production readiness.

• Managed global tooling execution and factory enablement; coordinated mechanical specifications, mold trials, vendor qualification, and manufacturing process readiness for high-volume platforms.
• Optimized injection-molding tooling and process parameters, reducing cycle time by 10+ seconds and improving production throughput on high-volume products.
• Led Six Sigma DMAIC project resolving structural deformation issues (2nd place company-wide engineering competition); accelerated tooling development achieving T0 samples in 18 days across multiple plastic and metal tools.

Senior Mechanical Engineer at Qisda Corporation (2010-04 – 2013-03)

Designed mechanical architectures for ASUS monitor platforms, managing structural integrity, modular configurations, cosmetic requirements, and mass-production readiness.

• Architected modular single-model chassis supporting multiple I/O SKU configurations, reducing tooling investment and platform complexity.
• Accelerated mass-production launch by one month through design simplification and assembly optimization; engineered shared architectures that eliminated dedicated molds and lowered platform tooling cost; delivered ~30% manufacturing cost reduction and extended product lifecycle by 2 years.

Mechanical Engineer at ACES Electronics Co., Ltd. (2007-05 – 2010-04)

• Developed precision mechanical connector solutions, securing utility design patents; standardized designs across families to reduce manufacturing cost by 20%.
• Replaced high-cost materials with alternative resins for halogen-free lines, achieving 10–15% raw material cost savings while maintaining performance and reliability.

B.E. in Automation Engineering – National Formosa University (NFU), Taiwan (2000-09 – 2002-06)

Associate in Mechanical Engineering – St. John's University, Taiwan (1994-09 – 2000-06)