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PCB layout Engineer

Design
Programming.com
Maynard, United States2 weeks agoUntil 10/29/2026
Service contractOn-site

Job description

The ideal candidate should have strong relevant and recent technical and hands-on background and be able is hit the ground running as an individual contributor

  • Contribute to, or lead, PCB and package substrate layout development for leading-edge optical communication products.
  • Ensure compliance with IPC standards, company design practices, and fabrication capabilities.
  • Collaborate with electrical, mechanical, thermal, signal-integrity, power-integrity, and manufacturing teams.
  • Work with PCB fabricators, and substrate vendors to close DFMs.

Minimum Requirements

  • Bachelor’s degree or equivalent certifications with a minimum of 10+ years of relevant industry experience in PCB board and/or package substrate layout engineering.
  • Expert-level proficiency with Cadence Allegro PCB design tools
  • Strong demonstrated working experience of complex high-density, high-speed PCB and substrate designs using advanced HDI, stacked micro-via, sequential lamination, and fine-pitch BGA technologies.
  • Hands-on experience with complex multilayer high-density organic substrates, fine-pitch BGAs, and advanced component packages.
  • Working understanding of transmission line layout geometries and rules (micro strip, strip line, CPW, etc.)
  • Demonstrated experience in layout of compact low voltage and high current multiphase DC-DC power converters for state-of-the-art processors and GPUs
  • Strong understanding of PCB fabrication, assembly processes, DFM, and manufacturing tolerances.
  • Demonstrated success delivering high-volume, high-reliability communication products under aggressive schedules.

Highly Desired Skills

  • Demonstrated experience with mSAP PCB layout design
  • Demonstrated experience with layout design of state of art optical pluggable products (CFP2, QSFP-DD, OSFP)
  • Proficiency in Cadence SiP tools and Substrate layout techniques
  • Proficiency in layout of designs with Wire Bond components
  • Strong understanding of PCB fabrication and assembly processes
  • Strong knowledge of relevant industry standards (IPC Class 2/3, JEDEC, etc.)
Keywords
PCB Layout EngineeringCadence AllegroPCB and Package Substrate DesignHigh-Density Interconnect (HDI)Stacked MicroviasSequential LaminationFine-Pitch BGATransmission Line LayoutPower Converter LayoutSignal IntegrityPower IntegrityDesign for Manufacturability (DFM)PCB Fabrication and AssemblymSAP PCB LayoutCadence SiPIPC StandardsPCB LayoutPackage Substrate LayoutOptical Communication ProductsMultilayer Organic Substrates

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