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PCB Layout Engineer

Design
Programming.com
Maynard, United States2 weeks agoUntil 10/29/2026
Full timeOn-site

Job description

About the Role

We're looking for an experienced PCB Layout Engineer with strong, recent, hands-on technical experience. You'll work as an individual contributor and should be able to hit the ground running. You'll handle PCB and package substrate layout for leading-edge optical communication products.

Responsibilities

  • Contribute to or lead PCB and package substrate layout development for leading-edge optical communication products
  • Ensure designs comply with IPC standards, company design practices, and fabrication capabilities
  • Collaborate with electrical, mechanical, thermal, signal-integrity, power-integrity, and manufacturing teams
  • Work with PCB fabricators and substrate vendors to close DFM issues
Minimum Requirements
  • Bachelor's degree or equivalent certifications, with 10+ years of relevant industry experience in PCB board and/or package substrate layout engineering
  • Expert-level proficiency with Cadence Allegro PCB design tools
  • Proven experience with complex high-density, high-speed PCB and substrate designs using advanced HDI, stacked micro-via, sequential lamination, and fine-pitch BGA technologies
  • Hands-on experience with complex multilayer high-density organic substrates, fine-pitch BGAs, and advanced component packages
  • Working understanding of transmission line layout geometries and rules (microstrip, stripline, CPW, etc.)
  • Proven experience laying out compact low-voltage, high-current multiphase DC-DC power converters for state-of-the-art processors and GPUs
  • Strong understanding of PCB fabrication, assembly processes, DFM, and manufacturing tolerances
  • Track record of delivering high-volume, high-reliability communication products on aggressive schedules
Highly Desired Skills
  • Experience with mSAP PCB layout design
  • Experience with layout design of state-of-the-art optical pluggable products (CFP2, QSFP-DD, OSFP)
  • Proficiency in Cadence SiP tools and substrate layout techniques
  • Proficiency in layout of designs with wire bond components
  • Strong knowledge of relevant industry standards (IPC Class 2/3, JEDEC, etc.)
Keywords
Cadence AllegroPCB LayoutPackage Substrate LayoutHigh-Density Interconnect (HDI)Stacked Micro-ViasSequential LaminationFine-Pitch BGAHigh-Speed DesignTransmission Line LayoutPower Converter LayoutPCB FabricationDesign for Manufacturability (DFM)Cadence SiPmSAP LayoutWire Bond LayoutIPC StandardsOptical Communication ProductsMultilayer Organic SubstratesTransmission LinesMicrostrip

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