PCB Layout Engineer
Design
Maynard, United States2 weeks agoUntil 10/29/2026
Full timeOn-site
Job description
About the Role
We're looking for an experienced PCB Layout Engineer with strong, recent, hands-on technical experience. You'll work as an individual contributor and should be able to hit the ground running. You'll handle PCB and package substrate layout for leading-edge optical communication products.
Responsibilities
- Contribute to or lead PCB and package substrate layout development for leading-edge optical communication products
- Ensure designs comply with IPC standards, company design practices, and fabrication capabilities
- Collaborate with electrical, mechanical, thermal, signal-integrity, power-integrity, and manufacturing teams
- Work with PCB fabricators and substrate vendors to close DFM issues
- Bachelor's degree or equivalent certifications, with 10+ years of relevant industry experience in PCB board and/or package substrate layout engineering
- Expert-level proficiency with Cadence Allegro PCB design tools
- Proven experience with complex high-density, high-speed PCB and substrate designs using advanced HDI, stacked micro-via, sequential lamination, and fine-pitch BGA technologies
- Hands-on experience with complex multilayer high-density organic substrates, fine-pitch BGAs, and advanced component packages
- Working understanding of transmission line layout geometries and rules (microstrip, stripline, CPW, etc.)
- Proven experience laying out compact low-voltage, high-current multiphase DC-DC power converters for state-of-the-art processors and GPUs
- Strong understanding of PCB fabrication, assembly processes, DFM, and manufacturing tolerances
- Track record of delivering high-volume, high-reliability communication products on aggressive schedules
- Experience with mSAP PCB layout design
- Experience with layout design of state-of-the-art optical pluggable products (CFP2, QSFP-DD, OSFP)
- Proficiency in Cadence SiP tools and substrate layout techniques
- Proficiency in layout of designs with wire bond components
- Strong knowledge of relevant industry standards (IPC Class 2/3, JEDEC, etc.)
Keywords
Cadence AllegroPCB LayoutPackage Substrate LayoutHigh-Density Interconnect (HDI)Stacked Micro-ViasSequential LaminationFine-Pitch BGAHigh-Speed DesignTransmission Line LayoutPower Converter LayoutPCB FabricationDesign for Manufacturability (DFM)Cadence SiPmSAP LayoutWire Bond LayoutIPC StandardsOptical Communication ProductsMultilayer Organic SubstratesTransmission LinesMicrostrip
Interested in this role?