Inlighten TechnologiesInLighten Technologies is a Silicon Valley company developing next-generation microLED technologies for augmented reality (AR) and AI-powered smart glasses. Our mission is to push the limits of microLED performance and manufacturing, enabling scalable, mass-market production. Join us to help create the displays that will power the future of immersive computing.
DescriptionWe are seeking a Process Development Engineer - Packaging, to support the development and mass production of microLED AR light engines.
This role will focus on advanced packaging processes, including die bonding, interconnection, optical integration, and reliability, working closely with device, optics, and system teams to transition technologies from R&D to volume manufacturing.
Develop, optimize, and qualify packaging processes for microLED AR light engines.
MicroLED die bonding with FPC/PCB
Wafer-level or panel-level packaging
Optical component integration (waveguides, collimators, micro-optics, etc.)
Define process flows, DOEs, and control plans for new packaging technologies
Drive yield improvement, defect reduction, and cost optimization
Support EVT / DVT / PVT builds and ramp to mass production
Perform failure analysis and root cause investigations related to packaging and assembly
Collaborate with device, optics, system, equipment, and manufacturing teams
Work with equipment vendors, and material suppliers
Generate and maintain process documentation, specifications, and qualification reports
Bachelor's degree or above in Materials Science, Electrical Engineering, Mechanical Engineering, or related field
3-7 years of experience in advanced packaging or process development
Strong understanding of semiconductor and optoelectronic packaging processes
Hands-on experience with die attach, bonding, interconnect, and assembly processes
Experience running DOE, process characterization, and data analysis
Familiarity with yield, reliability, and manufacturing metrics
Ability to work in a cross-functional, fast-paced R&D-to-production environment
Ability and willingness to travel internationally up to 20%
Advanced degree (MS or PhD) in a relevant field of study.
Direct experience with microLED, LED, or CIS packaging
Experience in AR light engines or optical module packaging
Familiarity with reliability testing (thermal cycling, HTOL, humidity, drop, etc.)
Hands-on experience with process yields analysis and defect characterization
Benefits & Perks
$104k - $208k/year
Comprehensive health, dental, and vision insurance.
401(k) retirement plan
InLighten Technologies is an equal opportunity employer that is committed to inclusion and diversity. We promote equal opportunity for all applicants without regard to race, color, religion, sex, gender identity, sexual orientation, national origin, disability, veteran status, or any other legally protected characteristics.
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