25 module development opportunities in Chandler updated today
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IntelJob Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Tec
# **Job Details:** ## **Job Description:** *The Role and Impact** Join Intel's Advanced Packaging Technology Development team as an **Advanced Packaging Research and Development Engineer** where you will drive innovation and help shape the future of advanced IC packaging solutions. In this role, you
Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Tec
# **Welcome!**## .Packaging Module Development Engineer page is loaded## Packaging Module Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0282474# **Job Details:**## Job Description:The Advanced Packaging Technology Manufacturing (A
# **Welcome!**## .Packaging Module Development Engineer page is loaded## Packaging Module Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Yesterdayjob requisition id: JR0282430# **Job Details:**## Job Description:The Advanced Packaging Technology Manufacturin
Intel Corporation# **Job Details:** ## **Job Description:** The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the
# **Welcome!**## .Packaging Module Development Engineer page is loaded## Packaging Module Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0282430# **Job Details:**## Job Description:The Advanced Packaging Technology Manufacturing (A
IntelJob Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Tec
# **Welcome!**## .Test Module Development Engineer page is loaded## Test Module Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0281628# **Job Details:**## Job Description:Intel's Advanced Packaging Technology Manufacturing (APTM) g
IntelJob Details: Job Description: Intel's Advanced Packaging Technology Manufacturing (APTM) group is a critical division driving the next generation of semiconductor packaging solutions. The team focuses on groundbreaking technologies that extend beyond traditional methods to enable the future of high-
A leading technology company in Phoenix, Arizona seeks a Test Module Development Engineer. This position aims to develop avant-garde semiconductor packaging solutions for high-performance computing. Responsibilities include executing test technology development, partnerships with suppliers, and impl
A leading technology company is seeking a qualified candidate for an on-site role focused on advanced semiconductor packaging solutions. Responsibilities include developing testing processes and collaborating with suppliers for innovative technologies. Candidates should have a relevant degree and ex
# **Welcome!**## .Packaging Module Development Engineer page is loaded## Packaging Module Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0282474# **Job Details:**## Job Description:The Advanced Packaging Technology Manufacturing (A
# **Welcome!**## .Advanced Packaging Module Development Engineer page is loaded## Advanced Packaging Module Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0282579# **Job Details:**## Job Description:**The Role and Impact**Join Inte
# **Welcome!**## .Advanced Packaging Module Development Engineer page is loaded## Advanced Packaging Module Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0282579# **Job Details:**## Job Description:**The Role and Impact**Join Inte
# **Welcome!**## .Advanced Packaging Module Development Engineer page is loaded## Advanced Packaging Module Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0282579# **Job Details:**## Job Description:**The Role and Impact**Join Inte
A leading semiconductor company in Phoenix, AZ, is seeking an Advanced Packaging Module Development Engineer to drive innovation in IC packaging solutions. You'll optimize processes and equipment while ensuring quality and yield at a module level. Candidates must have a Bachelor's degree in a releva
A leading semiconductor company in Phoenix is seeking an Advanced Packaging Research and Development Engineer. This role involves driving innovation in advanced IC packaging, developing processes to meet quality and productivity standards. Candidates should have a Bachelor's degree in a relevant fie
A global technology company in Phoenix, Arizona, seeks an Advanced Packaging Research and Development Engineer. This role involves optimizing processes and equipment to meet ambitious technology goals. Candidates should possess a bachelor's degree in engineering and have at least 4 years of relevant
# **Welcome!**## .Packaging Module Equipment Development Engineer page is loaded## Packaging Module Equipment Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Yesterdayjob requisition id: JR0282101# **Job Details:**## Job Description:The Advanced Packaging Tec
IntelJob Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Tec
# **Job Details:** ## **Job Description:** Intel's Advanced Packaging Technology Manufacturing (APTM) group is a critical division driving the next generation of semiconductor packaging solutions. The team focuses on groundbreaking technologies that extend beyond traditional methods to enable the fu
Overview Join Intels Advanced Packaging Technology Development team as an Advanced Packaging Research and Development Engineer. You will drive innovation and help shape the future of advanced IC packaging solutions, optimizing processes and equipment to meet Intels roadmap for assembly packaging pla
# **Welcome!**## .Packaging Module Equipment Development Engineer page is loaded## Packaging Module Equipment Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0282101# **Job Details:**## Job Description:The Advanced Packaging Technol
Job Details The packaging module equipment development engineer develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of pac
IntelJob Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Tec
Intel Corporation# **Job Details:** ## **Job Description:** The packaging module equipment development engineer develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the eff
Taiwan Semiconductor Manufacturing Company LimitedCompany TSMC Arizona Corporation Location USA-Arizona Employment Type Regular Posted Mar 23, 2026 At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world's most brilliant innovators entrust us to transform their ideas into world-changing products that im
Select how often (in days) to receive an alert: At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. As long as you have the sa
$40,000 – $63,000/year
Estimation confidence: Low
Estimate based on market data for Chandler. Actual salaries may vary depending on experience, company, and area.
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