Technology Development Trainee

STATS ChipPAC Talent Trainee Program Program Details

1.

Tailored Education

Program A global learning environment, including overseas rotational assignments (18–24 months).

Professional technical and corporate culture training leveraging STATS ChipPAC’s global network.

• Learning and Development Support

Coaching: Expert coaching to enhance individual competencies.

Mentoring: Dedicated mentoring from experienced professionals.

Peer Learning: Knowledge sharing and teamwork-driven collaboration.

HR Support: Systematic career development and growth opportunities.

• Practical, Hands-on Learning

Collaborate with semiconductor packaging experts through domestic and international assignments.

Gain real-world problem-solving experience by participating in diverse team projects. Eligibility

Fields of Study: Semiconductor Packaging, Chemical Engineering, IC, Materials Science, Microelectronics, Mechanical Engineering, Industrial Engineering, Optoelectronics, Physics, Electronics, and other related fields.

Academic Requirements: Master’s or Doctoral degree holders (including expected graduates).

Additional Qualifications

Willingness to participate in overseas rotational assignments.

Strong teamwork and problem-solving skills.

Proficiency in global communication.