Akshay Suresh
Engineering Intern – GPU/CPU Thermal Analysis
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About
Analyzed 8 CPUs/GPUs, achieving a 55% improvement in thermal performance through design and testing iterations Built a chip database (RTX 5090, Xeon 6 6980P, EPYC 9965, MI355X) with TDP and zone-based heat flux data, verified against die photos Conducted literature review on GPU/CPU thermal management and manifold microchannel (MMC) cooling techniques
Experience
Engineering Intern – GPU/CPU Thermal Analysis - KoolMicro - Yuseong, Daejeon, South Korea
(2026-06 - 2026-09)
- Analyzed 8 CPUs/GPUs, achieving a 55% improvement in thermal performance through design and testing iterations
- Built a chip database (RTX 5090, Xeon 6 6980P, EPYC 9965, MI355X) with TDP and zone-based heat flux data, verified against die photos
- Conducted literature review on GPU/CPU thermal management and manifold microchannel (MMC) cooling techniques
- Developed power maps for GPU/CPU dies to identify hotspots and guide sensor/heater placement
- Collaborated with Dr. Soohwan Kim and a 2-person Georgia Tech research team in Atlanta on thermal analysis methodology and cooling design
Payload Team Member - UCSC Rocket Team - Santa Cruz, CA
(2025-09 - 2026-05)
- Contributed to a 12-person subteam that validated 8 major payload subsystems ahead of the team's spring launch
- Contributed to a 3U CubeSat payload integrating track-guided vehicle deployment, sabot ejection, and dual-deploy recovery
- Worked with a custom avionics PCB and STM32 flight software/state machine for onboard data logging and GPS tracking
- Helped validate a spring-deployed fin release/locking mechanism with active fin control during descent
Participant - UCSD ECE Summer Internship Prep Program (SIPP) - San Diego, CA (Remote)
(2026-07 - 2026-08)
- Built technical foundations in Python, sensors and systems, and machine learning through a structured ECE internship-readiness curriculum
- Developed professional skills in resume building, technical communication, and academic/career planning to prepare for engineering internships
Engineering Intern – Thermal Testing & Hardware Prototyping - KoolMicro - Yuseong, Daejeon, South Korea
(2025-06 - 2025-11)
- Implemented a 4-heater + 3-sensor resistor matrix for thermal testing; characterized circuit behavior via multimeter measurements
- Analyzed thermal coupling; recommended Carbon/Metal film resistors for improved performance
- Explored Raspberry Pi + Arduino integration to prototype an automated data collection and temperature sensing system
Research Intern - Polygence - Stanford, CA
(2023-06 - 2023-09)
Developed a Raspberry Pi 4–based project analyzing cost-effectiveness of Radar, LiDAR, and Computer Vision in self-driving technologies, with a test bench evaluating performance under varying conditions
Education
B.S. - Computer Engineering - University of California, Santa Cruz (2024-09 - 2028-06)
High School Diploma - Washington High School (2020-08 - 2024-06)
