Duane Brazeau

Accomplished semiconductor technician with over 15 years of experience in failure analysis, testing, and process optimization within the semiconductor industry. Proven ability to utilize advanced tools such as SEM, TEM, FIB, and EDS for material and defect analysis, ensuring compliance with engineering standards and improving product reliability. Adept at troubleshooting complex hardware components, conducting root cause analysis, and collaborating with engineers to support new product launches and enhance yield performance.

Skilled in cleanroom operations, equipment maintenance, and lab management, with a strong commitment to safety and operational efficiency.

Senior TEM Specialist - Samsung Austin Semiconductor

• Perform characterization of thin film samples and device measurements such as Vpi, optical loss, and RF probing, following established protocols.
• Execute or outsource additional measurements required per FA scenario (e.g., SEM, TEM, AFM, SIMS, etc).
• Compile raw measurement data and manage a failure analysis database to maintain data integrity and provide data reporting for FA projects.
• Report regularly on FA projects to the entire Engineering team.
• Follow instructions, including standard operating procedures and processes.
• Initiate and own FA projects, driving them to completion.
• Demonstrate exacting attention to detail, which is essential for this position.
• Exhibit safety awareness, safe work practices, and laboratory hygiene.
• Other duties or projects assigned.

RF Failure Analysis Technician - RACOM - Lacey, WA

(2024-03 - 2024-08)

• Oversaw staging for various L3Harris P25 Radio systems, with a combined value exceeding $35M.
• Established and executed comprehensive testing protocols, ensuring accurate calibration and defect-free radio assets.
• Collaborated with engineering teams to diagnose & resolve RF issues, boosting system reliability and performance.
• Delivered support during system installations and upgrades, achieving smooth integration with existing setups.
• Performed detailed inspections and quality control checks, greatly minimizing defects and reducing customer complaints.

Server Failure Setup - Amazon Web Services - Hebron, KY

(2022-05 - 2023-02)

• Determined appropriate dies for removal based on gathered data, conducting detailed firmware analysis to identify potential malicious code.
• Utilized Python to extract and review firmware from dies on server cards for security validation.
• Implemented detailed hardware diagnostics to assess the integrity of components and mitigate security risks.
• Collaborated with team members to troubleshoot and resolve hardware-related issues affecting server card performance.
• Conducted firmware comparisons across multiple devices to verify code legitimacy and prevent unauthorized alterations.

Engineer Technician/Physical Failure Analysis - Intel Corporation - Santa Clara, CA & Hillsboro, OR

(2016-09 - 2021-10)

• Performed physical Failure Analysis on SRAM and Nano probed circuits to confirm probe test results.
• Connected thermo-couples to heat exchangers and server blades, recording precise temperature measurements.
• Assembled thermal test units and mounted heat exchangers onto CPU sockets within server blades.
• Integrated DIMMs with heat sinks, affixed thermo-couples, and installed them into server systems.
• Debugged, built, and troubleshot CPUs, memory modules, hard drives, and CPU boards, ensuring lab testing systems functioned effectively.
• Executed Python scripts to conduct server processor testing.
• Operated various electrical measurement instruments such as digital meters, oscilloscopes, function generators, and logic analyzers to support testing processes.
• Facilitated I2C communication implementation for microcontrollers within lab systems.
• Oversaw the IODV lab, ensuring compliance with safety protocols and maintaining equipment readiness.

Senior Engineering Specialist - Seagate Technologies - Bloomington, MN

(2007-08 - 2014-05)

• Operated Transmission Electron Microscopes, Dual Beam and Single Beam FIBs, and Scanning Electron Microscopes to support engineering tasks.
• Established a fully operational Failure Analysis (FA) Lab, managing capital equipment purchases, and rebuilding microscopes, computers, air tables, and CVD systems to meet budget requirements.
• Supervised a team of FA Technicians, ensuring efficient lab operations and high-quality output.
• Collaborated with design engineers to develop innovative memory products, supporting new product launches.
• Assembled custom computers for resale, installing hard drives, memory, optical drives, and other hardware components as specified.
• Captured SEM images to verify CMP and CVD specifications, ensuring compliance with engineering standards.
• Conducted material and defect analysis using Bruker EDS, identifying key issues for engineering resolution.

B.S. - Manufacturing Engineering Technology - University of North Texas

A.A.S. - Material Science and Engineering - Erie Community College

Certificate - Analytical Electron Microscopy - LeHigh University