Jason Huo

Extensive Engineering Background. PhD in electronic materials and semiconductor processing. Recognized electrochemist. Electronic device HW & SW design.

Experience in mechanical design. Hands-on experience with various analytical instrumentation. 20+ Years of Hands-on Experience in R&D.

Strong

Foundation in Sensor Technologies.

R&D Manager at Endress + Hauser, Inc. (2023-01 – Present)

Manage R&D Department and key projects; have developed new sensor technologies and products; have been granted seven U.S. and international patents. Manage multi-disciplinary and international teams of scientists, engineers, and technicians to develop advanced EC and optical sensors. Design technical specific products (TSP); create TSP BoM, Router, and WI in SAP.

Lead cross-functional teams to perform process/product failure analysis and improve manufacturing processes and product quality. Provide technical support to QC, procurement, and sales/customers.

Principal Engineer at Endress + Hauser, Inc. (2013-01 – 2022-12)

Electrochemist (Contractor) at Agilent Technologies, Inc. (2012-01 – 2013-12)

Developed electrolytes, process, and electrochemical system for micro-device fabrication, including conceptual and 3D mechanical design.

Senior Staff Engineer at Multi-Fineline Electronix, Inc. (2009-01 – 2011-12)

• Established MFLEX Lab from scratch.
• Managed MFLEX Lab for Materials Analysis & Tests, including optical thin film measurements.
• Developed processes for accurate measurement of electronic circuits achieved total Gauge R&R less than 5%.
• Led internation/cross-functional team and performed failure analysis of a dynamic FPC.

Senior Manufacturing Engineer at Innopad, Inc. (2009-01 – 2009-12)

• Troubleshot manufacturing processes; identified root cause of defects; modified the processes accordingly and increased product yield from 34% to 96%.
• Designed and tested Auto-Spreading Apparatus, which increased productivity 4 times.

Materials Scientist at Fujimi Corporation (2005-01 – 2008-12)

• Developed ECMP tool and processes for ULSIC fabrication.
• Researched sensor technique for in-situ CMP process and slurry analysis.
• Supervised Fujimi-PSU collaboration project (PhD student thesis research).

Postdoctoral Researcher at Air Liquide Group, Chicago Research Center (2004-01 – 2005-12)

• Invented Electrochemical Planarization System and Method of Electrochemical Planarization.
• Won the third award at Air Liguide Group (worldwide) for a research proposal.

Intel-University Project Contractor at Intel Corporation (2001-01 – 2002-12)

• Performed thin film characterization and analysis using various advanced analytical techniques such as SEM/EDS, FIB, TEM, XRD, n&k Analyzer, Prism Coupler, and Spectroscopic Ellipsometry.
• Researched "electroplating of copper alloy onto silicon substrates".

Ph.D. in Electrical Engineering (majored in electronic materials and semiconductor processing) – Oregon Health and Science University (2004-01)

M.S. in Materials Science and Engineering – Oregon Graduate Institute of Science and Technology (OGI) (1999-01)

B.S. & M.S. in Materials Science and Engineering – Chongqing University