Michael Leonoras

Core Manufacturing & Technical Skills Over 19 years of experience driving New Product Introduction (NPI) of varying complexity from prototype (EVT/DVT/PVT) to mass production scaling including technology transfer from site to site across high-compliance sectors including Defense, Aerospace, Medical, and Telecommunications. Proven success managing high-mix, low-volume manufacturing in fast-paced production environments. Extensive hands-on expertise in Surface Mount Technology (SMT/PCBA) processes, root cause analysis, continuous improvement, machine selection/acquisition/machine buy-off, OEE and line balancing.

Proven expertise in full system integration and box build assembly processing including PCB depanelization, underfill, potting, conformal coating, selective, and wave soldering, precise mechanical assembly, wire harness integration, press-fit techniques, and laser marking to deliver high-quality, final-stage products. With solid experience in Chip on Board (COB) processes within cleanroom Class 100 and Class 10K cleanroom environments, specializing in wafer saw, adhesive dispensing, die attach, ultrasonic wire bonding and encapsulation. Hands-on PCB Design for Manufacturability (DFM) review of awarded project including product feasibility assessment.

An experienced Quality and Regulatory professional with comprehensive expertise in implementing industry-standard validation, planning, and statistical methodologies across complex engineering environments. Demonstrated proficiency covers APQP, PPAP, and full lifecycle qualification protocols (IQ/OQ/PQ). Highly skilled in risk mitigation and process optimization utilizing Design and Process Failure Mode and Effects Analysis (DFMEA & PFMEA), Statistical Process Control (SPC), Design of Experiments (DOE), and Measurement System Analysis (MSA).

Additionally, holds a certified background in electronic standards with IPC-610 (Acceptability of Electronic Assemblies) credentials, ensuring rigorous compliance and high-yield operational excellence. Driven LEAD manufacturing to maximize continuous improvement, OEE, and manufacturing excellence. Skilled in Root cause analysis mainly diagnosing and solving core issues using Fishbone Diagrams and 5 Whys.

Proficient in executing SWOT Analysis, PDCA cycles, and Process Mapping to optimize workflows. Dedicated engineering leader with an excellent record in mentoring, coaching and training engineers, technicians, and production personnel.

Operations Manager - DEC Electronic Assembly LLC

(2025-09 - 2026-05)

• Managed quick-turn daily production schedules across aerospace, telecommunication, defense, medical, industrial, and computing markets.
• Reduced company overall assembly scrap by 18% by introducing Semi-Auto PCB depanelization instead of Manual cutting, cleaning basket fixture modification and IPC 610 standard refresher training.
• Generated $16K potential cost savings by repairing SMT convection reflow damaged fan and conveyor malfunction, Non-functional ERSA rework system and Aqueous cleaning machines damaged motor.
• Reduced solderability rejects by 25% via introducing semi-automatic stencil cleaning eliminating clogged, stencil DFM and basic characterization on Screen printing parameters.
• Developed comprehensive training programs for 40 production personnel, increasing assembly line safety and reducing operational errors.

Sr. Manufacturing Engineer - Express Manufacturing Inc.

(2025-02 - 2025-08)

• Spearheaded site-wide PFMEA training and led the end-to-end generation of PFMEAs across all 70 Process stations.
• Managed to optimized LCD assembly line increase capacity by of 22% for an Aerospace project from 10 assemblies per hour to 45 through introduction of LEAN principles to drive improvement.
• Successfully launch the manufacturing set-up from empty space, scaling, facilitation, layout, documentation, and process development of complete LED assemblies with SMT, Box build assembly, testing requirement and approved by the customer for mass production.
• Reduced scraps on existing high runner project by 11% through process improvement via improving the soldering fixture design, transitioning batch oven cure epoxy of 1.5 hrs to UV cure with seconds of curing.
• Assigned as team leader of addressing all site Conformal coating issues including Design of Experiment activity for Defense project to eliminate reliability failure.

Engineering Manager / Operations Lead - Integrated Micro-electronics - USA

(2022-05 - 2024-12)

• Managed the full lifecycle of an SMT line installation, including budget authorization, vendor/machine selection, procurement, buy-off, and final production release to increase line capacity.
• Executed comprehensive PCB DFM reviews and technical risk assessments for an average of 8 customers per month.
• Spearheaded NPI, global scale-up and technology transfers from pilot plants at IMI USA to full-scale production sites (EVT, DVT, PVT) across Guadalajara, China, and Serbia using APQP/PPAP frameworks.
• Served as the cross-site internal consultant for the automotive camera business, aligning manufacturing standards and technical strategies across IMI Global Sites.
• Developed comprehensive training programs for 7 Engineers, 2 Technician and 12 Production personnel, increasing assembly line safety and reducing operational errors.

Principal Engineer 2 - Advanced Manufacturing Engineering - Integrated Micro-Electronics Inc. - Philippines (Headquarters)

(2018-05 - 2022-04)

• Led the hands-on, accelerated CPAP prototype assembly and manufacturing of 10K pieces for COVID-19 relief.
• Drove food pump prototyping and scaled full assembly line transfers from IMI USA to IMI Philippines for COVID-19 response.
• Led hands-on prototyping and delivered a low-volume run of 30K of Cochlear implants utilizing SMT and wire-bonding technologies.
• Led factory-wide adoption of advanced technologies, aligning engineering execution with the corporate technology roadmap.
• Served as an internal cross-site consultant for the automotive camera business to standardize global manufacturing practices.
• Mentored and coached a high-performing team of 7 engineers, 4 technicians personnel to support operational growth.

Principal Engineer 1-Advanced Manufacturing Engineering - Integrated Micro-Electronics Inc. - Philippines Headquarters

(2014-07 - 2018-04)

• Led factory adoption of exotic technologies, aligning engineering execution with the corporate Technology Roadmap.
• Developed pioneering 1st-Silicon Dicing Technology capabilities tailored for MEMS and Power module silicon dies.
• Directed hands-on NPI MEMS dicing and assembly, scaling daily production output from 300 to 1,100 units.
• Managed Power module Cleanroom wire bonding development from initial prototype to a scale of 2,000 daily units.
• Led and drive the factory Request for Quotation (RFQ) process generation, evaluating an average of 400 RFQs annually.
• Served as global moderator for Process Failure Mode and Effect Analysis (PFMEA) across all IMI sites.
• Facilitated cross-site lessons-learned sessions to drive continuous improvement across IMI Global facilities.

Sr. Process Development Engineer – Process Engineering - Integrated Micro-Electronics Inc. - Philippines Headquarters

(2007-02 - 2014-06)

Launched the first complete automotive video camera assembly line at IMI Philippines:

• Managed SMT, COB, box build, and testing requirements from bare floor space to the delivery of the 10,000th unit in the first year.
• Achieved a 0-ppm defect rate during initial launch, scaled production from 10,000 units to a projected 5 million units within four years, and secured the "Best Contract Manufacturer" award by a Tier 1 company for 10 consecutive years.
• Led hands-on factory New Product Introduction (NPI) for next-generation automotive camera systems, supporting Tier 1 and Tier 2 suppliers across automotive, medical, and aerospace accounts.
• Isolated the root cause of long-term reliability ECM failures and Electronic Control Unit (ECU) recalls for a Tier 1 customer across IMI Guadalajara and IMI China with estimated $500K cost savings.
• Led the resolution of Battery Discharged Unit (BDU) issues related to capacitor failure in IMI Guadalajara with estimated $200K cost savings.
• Led hands-on of the factory Request for Quotation (RFQ) process, evaluating and assessing an average of 400 RFQs annually.

Process Engineer - Process Engineering - Integrated Micro-Electronics Inc - Philippines Headquarters - Laguna, PHL

(2000-12 - 2007-01)

Awarded "Engineer of the Year" for spearheading continuous improvement and scrap-reduction projects.

• Directed end-to-end product launch of an Industrial Card Reader from prototype to mass production; scaled manufacturing output to 50K units per month using SMT (PCBA) and Chip on Board (COB) Class 10K technologies.
• Developed and launched Advanced Digital X-ray flat-panel detectors for medical imaging, integrating SMT (Flex PCB), COB, and box-build assembly to meet a 9K daily output requirement.
• Transitioned manual potting application to full automation, increasing automotive project capacity from 30 to 120 units/hour and reducing scrap by 15%.
• Developed and implemented the facility's first fully automated conformal coating capability to meet automotive and industrial demands.
• Designed a universal PCB holder for manual solder paste printing, improving setup times and reducing tooling costs for manual SMT lines.
• Transitioned manual PCB depanelization processes to full automation, resulting in improved cycle times and operator safety.

BS - Electronics and Communications Engineering - University of San Carlos Technological center Cebu City, PHL