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Nirali Thakker

Nirali Thakker

RF Engineer

Talent
Chicago, City of Chicago, CookMember since April 12, 2023
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About

Graduated in May 2018 with a Master's of Science in Electrical Engineering (MSE EE) specializing in Electromagnetics, Microwaves, Antennas, RF, and Analog from Arizona State University.

With a Bachelor’s Degree in Electronics & Communication Engineering, I have great understanding in RF, Microwaves, Antennas and Communication courses. I have a decent academic record with equal interest in extracurricular activities and community service.

Technical Skills

Tools - Cadence, ADS, Matlab, Keil, NGSpice, HFSS, MultiSim, MS Office

Platforms - Linux, Windows XP/VISTA/7/8/10

Experience

Staff RF Engineer – Motorola Mobility, A Lenovo Company Sep ’21 – Present 

  • • Working on calibrating and measuring cellular devices for TX ACLR, SAR DSI, RX Sensitivity, etc. on LTE and NR Low, Mid, High channel. 
  • • Working on TRX Lineup to compare Link Budget vs ADS Simulations vs Measured Data for TRX Lineup Optimization. 
  • • Working on validating schematic and layout for the project. 
  • • Collaborating across hardware and software teams to upgrade existing RF performance and ensure standardization compliance. 
  • • Understanding of 3gpp standards, regulatory, and carrier requirements, and technology like LTE, 5G, GSM, CDMA, WCDMA. 
  • • Hands-on experience with Call Box (CMW500, UXM, MT8000A), VNA, Signal Generator, Spectrum Analyzer. 
Staff Systems Test Engineer – Anokiwave, Inc. Jun ’18 – Aug’21 
  • • Worked on new product development teams on new silicon validation, characterizations of mmW IC’s for 5G and SATCOM. 
  • • Measured DC consumption, S-Parameters, Noise Figure, Compression, OIP3, IIP3, EVM, Variable Attenuator and Phase Shifter Metrics, Stability, Gain Slope over Temperature, Switching Speed, SPI Speed, Power and Temperature Detector, Z-Cal. Also, performing DK/ENG tests for customers. 
  • • Analyzed the measured data and presenting data to the design engineers for evaluation and debugging. Created preliminary reports for pre-release of the IC’s. 
  • • Hands-on experience with Spectrum Analyzer, VNA, Oscilloscope, Signal Generator, and Power Meter. Preparing stands to carry out tests. 
RF Testing & Software Co-op – Skyworks Solutions, Inc. Feb ’18 – May ’18 
  • • Performed RF Tests, evaluated, summarized and presented data to design engineers to assist in design evaluation and debugging. 
  • • Measured CW/LTE IMD, Harmonics, and Noise Figure on Broadband RF Couplers and Antenna Tuning Switches at various temperatures. 
  • • Measured Phase Noise, Gain, EVM, ACLR, Harmonics, and Ruggedness (power handling) on LTE Module (LNA & Switch) over different bands (1,2,5,11) at various temperatures. 
  • • Measured Switching Speed to determine rise and fall time on RF Switches at various temperatures. 
  • • Measured S-Parameters for Isolation, Insertion Loss, Directivity & Return Loss for RF Couplers & RF Switches. 
Analog Product Engineering Intern - Microchip Technology, Inc. Jul ’17 – Dec ’17 
  • • Worked with new product development teams on new silicon validation and characterization. 
  • • Prepared bench setups for silicon validation of an operational amplifier. 
  • • Tested DC electrical characteristics of operational amplifier using the Semiconductor Parameter Analyzer, and LabVIEW. 
  • • Analyzed tested data using excel and validated the datasheet values. Prepared validation and characterization reports. 
  • • Provided product development support which involved interfacing with Design, Test Engineering, and others. 
  • • Performed cost reduction activities such as yield enhancement, test time reduction, etc. 
Electrical Engineering Intern - Hitachi Home & Life Solutions (India) May ’14 – Aug ’14 
  • • Conducted handset study & microcontroller programming (Keil). 
  • • Examined the Surface Mount Device, pin through hole type PCBs and the connections on the masking of the PCB. 
  • • Examined the basic and backlight handsets for split air conditioners for different modes. 
  • • Programmed various types of LED interfacing using PIC18 series and assembly language. 

Education

Master of Science in Engineering, Electrical Engineering Arizona State University GPA: 3.54/4 May 2018

Bachelor of Engineering, Electronics & Comm. Engineering Gujarat Tech. University, India GPA: 3.5/4 May 2015

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