Specialist Manufacturing Engineer - L3 Technologies Telemetry & RF Products
(2015-07)
Establish the process for manufacturing high reliability satellite telemetry and COMSEC electronics including the creation of routers, test instructions, and tooling/fixturing.
- Support new product development and implement manufacturing processes for printed wiring assemblies and sub-assemblies.
- Present Manufacturing Readiness Reviews (MRR) to customers prior to the start of production.
- Participate in failure analysis teams with quality engineering for customer failure review boards and ensure corrective actions are in place.
- Contribute to resolving quality issues with receiving inspection on incoming EEE components and mechanical parts.
- Maintain certifications in J-STD-001F, J-STD-001FS, IPC-A-620, and IPC-A-610E
- Maintain Top Secret Security Clearance including SCI.
- Work closely with product engineering to evaluate and approve engineering drawings and/or change requests of PWA, Module, and Top Assemblies for satellite Telemetry.
- Participate in and guide Design for Manufacturability of new products during transition from design to production by reducing production time.
- Subject matter export on Aqueous Zero Ion for ionic contamination, X-Ray, and XRF. This includes employee training, maintenance, and calibration.
- Lean Six Sigma Green Belt training including a project to improve the design verification test process for new products to prevent failure escapes on flight hardware.
Failure Analysis Engineer - Hewlett Packard
(2013-07 - 2015-06)
Perform non-destructive and destructive analysis of electronic components and assemblies for HP's products in order to determine root cause of failures and predict future failures from occurring.
- Lean Six Sigma Green Belt training including a LSS project to route factory hardware failures to FA labs by using a new ERP system to implement closed loop corrective action.
- Work with other businesses and reliability engineers to recommend corrective action using 8D methodology in order to prevent failure reoccurrence.
- Utilize a variety of equipment for analytical failure analysis including Optical Microscopy, Scanning Electron Microscopy (SEM), Energy Dispersive X-ray (EDS), Fourier Transform Infrared Spectrometry (FTIR), Scanning Acoustic Microscopy (CSAM), X-Ray and 3D Computer Tomography X-Rays.
- Execute chemical decapsulation on integrated circuits, cross-sectioning of PWAs and components using metallographic polishing equipment, electrical testing and characterization, reliability stress testing of electronics within environmental chambers, Dye & Pry of BGA and QFPs, and X-Ray Fluorescence to determine plating thickness and material stack-up.
