Senior Process Engineer PCB at YADRO FAB DUBNA (2022-04 – Present)
- Launched production from scratch while overseeing facility construction, infrastructure, and equipment layout.
- Ensured seamless production of server and storage PCB assemblies
- Process improvements were implemented, resulting in an 80 % reduction in metallization defects
- Oversaw equipment modernization and integration into production line
- Developed and implemented quality control procedures
- Conducted international business trips for process implementation
Process Engineer PCB at NOVATOR (2019-11 – 2022-04)
- Gaining substantial expertise through collaboration with MacDermid
- Selected PCB production processes and defined required materials/chemicals
- Implemented PCB processes and provided on‑site technical support at Russian customers' facilities
- Resolved production issues and translated technical documentation (instructions, articles, equipment docs)
Process Engineer PCB at TEHNOTEH (2016-09 – 2019-11)
- Boosted metallisation productivity by 30 % via direct metallisation step
- Oversaw 3 processes: electroless copper, direct metallisation (cassette‑type with palladium), and Blackhole
- Eliminated copper plating pitting for defect‑free coating
- Monitored PCB plating processes, including dielectric activation and metal finishes (Cu,Sn, Ni, Au, Ag)
- Managing the section's technical equipment, overseeing and procuring consumables and chemicals
- Selecting technological equipment, commissioning it, and providing technological supervision of its operation
