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Andrei

Andrei

PCB Process Engineer with 10+ years in manufacturing operations

Nhân tài
Ho Chi Minh CityThành viên từ 5 tháng 7, 2026
Analytical thinking and attention to detailStrong work ethic and initiativeAbility to work under pressureTeam player with leadership potentialAdaptable to new technologies and processes
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Thuê người này

Gửi đề nghị công việc trực tiếp cho ứng viên này

Analytical thinking and attention to detailStrong work ethic and initiativeAbility to work under pressureTeam player with leadership potentialAdaptable to new technologies and processes

Giới thiệu

PCB Process Engineer with 10+ years in manufacturing operations. Turn complex production issues into stable, scalable solutions. Drive quality through team training, IPC compliance, and SPC. Focused on continuous improvement and consistent cross‑shift performance.

Kinh nghiệm

Senior Process Engineer PCB at YADRO FAB DUBNA (2022-04 – Present)

  • Launched production from scratch while overseeing facility construction, infrastructure, and equipment layout.
  • Ensured seamless production of server and storage PCB assemblies
  • Process improvements were implemented, resulting in an 80 % reduction in metallization defects
  • Oversaw equipment modernization and integration into production line
  • Developed and implemented quality control procedures
  • Conducted international business trips for process implementation

Process Engineer PCB at NOVATOR (2019-11 – 2022-04)

  • Gaining substantial expertise through collaboration with MacDermid
  • Selected PCB production processes and defined required materials/chemicals
  • Implemented PCB processes and provided on‑site technical support at Russian customers' facilities
  • Resolved production issues and translated technical documentation (instructions, articles, equipment docs)

Process Engineer PCB at TEHNOTEH (2016-09 – 2019-11)

  • Boosted metallisation productivity by 30 % via direct metallisation step
  • Oversaw 3 processes: electroless copper, direct metallisation (cassette‑type with palladium), and Blackhole
  • Eliminated copper plating pitting for defect‑free coating
  • Monitored PCB plating processes, including dielectric activation and metal finishes (Cu,Sn, Ni, Au, Ag)
  • Managing the section's technical equipment, overseeing and procuring consumables and chemicals
  • Selecting technological equipment, commissioning it, and providing technological supervision of its operation

Học vấn

Specialist in Department of Chemistry and Biology. Chemist – MARI STATE UNIVERSITY (2008 – 2013)

Đánh giá

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