Warren Macaraig
IC Substrate/MIS/Fan out PLP
Diese Person einstellen
Senden Sie diesem Kandidaten direkt ein Jobangebot
Über
Senior Process & Technology Specialist with 17+ years in IC substrate, PCB, and advanced packaging, @including FOPLP, MIS-BGA, MIS-QFN, and Embedded Component Packaging. Proven track record in @yield improvement, technology integration, NPI, and DOE-driven optimization. Strong expertise in @Solder Resist, Dry Film, Layer Build-Up, and Lithography.
Extensive hands-on work in R&D, factory @ramp-up, equipment qualification, and customer interface. Skilled in SPC, FMEA, FA, JMP, 8D, and model based problem-solving techniques.
Berufserfahrung
Senior Process & Technology Specialist with 17+ years in IC substrate, PCB, and advanced packaging,
including FOPLP, MIS-BGA, MIS-QFN, and Embedded Component Packaging. Proven track record in yield improvement, technology integration, NPI, and DOE-driven optimization. Strong expertise in
Solder Resist, Dry Film, Layer Build-Up, and Lithography. Extensive hands-on work in R&D, factory ramp-up, equipment qualification, and customer interface. Skilled in SPC, FMEA, FA, JMP, 8D, and model based problem-solving techniques.
