Skip to main content
L Srujan

L Srujan

Firmware Engineer with hands-on experience in 5 kW Grid-Tied Inverters and real-time control systems

Talent
BengaluruMember since June 20, 2026
Embedded CInfineon XMCSTM32FreeRTOSMPPTOrCADBoard Bring-upI2CSPICANRS485 Modbus
·

Hire this person

Send a job offer directly to this candidate

Embedded CInfineon XMCSTM32FreeRTOSMPPT

About

Firmware Engineer with hands-on experience in 5 kW Grid-Tied Inverters (GTI 5K), 16-cell BMS architectures, and real-time control loops using Infineon XMC MCUs. Experienced in supercapacitor balancing, cell-voltage monitoring, and hardware protection systems.

Embedded

Intern experienced in FreeRTOS multi-tasking applications, RS485 Modbus protocols, and OrCAD schematic design. Strong background in board bring-up, testing, signal integrity verification, and analog/digital debugging using oscilloscopes. Internship experience at HAL in aerospace quality, electronics integration, and safety practices.

Experience

Firmware Engineer at SIMLIFE ELECTRIC PVT LTD (2025-04 – Present)

  • 5 kW Grid-Tied Inverter: Developed control firmware using MPPT, PI loops, and Modbus.
  • GTI User Interface (UI): Designed a dedicated UI for real-time monitoring and configuration.
  • 16-Cell BMS Architecture: Programmed cell balancing, SOC/SOH estimation, and protection logic.
  • Supercapacitor Balancing: Designed cell-voltage monitoring, balancing logic, and safety cut-offs.
  • Peripheral Drivers: Built drivers on Infineon XMC for PWM, ADC, Timers, UART, I2C, SPI, and CAN.
  • Hardware Validation: Executed board bring-up and verified PWM switching using oscilloscopes.

Embedded Software Engineer Intern at QUAD POWER SYSTEMS (2024-07 – 2025-04)

  • RTOS Firmware: Programmed an STM32 Talk Back System using FreeRTOS for 100+ inputs.
  • Industrial Protocols: Deployed RS485 Modbus firmware for reliable board-to-board data transfer.
  • Hardware Design: Designed OrCAD schematics and firmware for a 2-channel voltage meter.
  • Testing & Bring-Up: Conducted schematic verification and hardware debugging using oscilloscopes.

ALH Final Assembly Intern at HINDUSTAN AERONAUTICS LIMITED (HAL) (2023-08 – 2023-09)

  • Observed final assembly and electronics integration in helicopters.
  • Learned aerospace quality, documentation and safety practices.

Education

B.E. in Electronics & Communication Engineering – GM Institute of Technology (2024)

Reviews

Related