[경력/반도체] Unit Process Development Engineer for Etch

[경력/반도체]

Unit Process

Development

Engineer

모집분야

Unit Process Development Engineer

📋 주요업무

Onsemi is seeking a Etch Process Development process engineer for wide bandgap technology ramp to drive fast ramp of new technologies without quality issue in manufacturing factories for wide band gap technologies. These engineers will need to work with process integration engineering team, device team, package development, product engineering from fab tool selection, module unit process development, process integration flow, to enable new technologies and new products meeting customer requirement, manufacturability, high quality, and fast time to market delivery.

Responsibilities

• Identify the gaps in global operations and be strong team members of unit process development engineers for technology development from feasibility to production ramp.
• Develop capable processes that fit unified technology design rules.
• Ensure for each technology node a complete set of process characterization for process monitoring and intrinsic/extrinsic reliability for power devices by collaborating with process integration and device engineering team.
• Participate as operations representative for due diligence projects for wide band gap power products
• Own process development and qualification through collaboration with process integration engineers and device engineers to successfully qualify and ramp wide band gap products.
• Improve yield and cost through securing wide process window and complete understanding and reduction of process defects as a process owner.
• Improve tool capability through deep understanding in tool functionality and collaboration with equipment engineering team on Continuous Improvement Projects (CIP).

Qualificatons

• A minimum of 3 years of experience in semiconductor engineering related field in Dry Etch process. An advanced degree is preferred in semiconductor processing, device physics or compatible disciplines.
• Minimum 3+ years of hands-on experience in 8” fab with at least 0.25 um technology
• Experience with wide band gap technologies
• Developed and successfully ramped a technology to at least 1K wafers per a week
• Experience in working and leading cross functional teams and remote factories
• Ability to drive changes
• Willing to travel up to 20% of the time as required.
• Bucheon, Korea as a main work site.
• Business-level proficiency in English, both verbal and written

📋 자격요건

• 경력 3년 이상 ~ 6년 이하
• 대학교졸업(4년)이상

📋 우대사항

• 보유역량: 해당직무 근무경험, 영어가능자

🏠 근무조건

• 고용형태 : 정규직(수습 3개월)
• 급여 : 면접 후 결정
• 근무지 : 경기 부천시 평천로850번길 55
• 근무요일/시간 : 면접 후 결정

🎁 복지 및 혜택

• 급여제도 : 상여금, 장기근속자 포상, 퇴직금, 야근수당, 휴일(특근)수당, 4대 보험
• 지원금/보험 : 건강검진, 의료비지원(본인), 직원대출제도, 각종 경조사 지원, 의료비지원(가족), 체력단련실운영, 자녀학자금
• 출퇴근 : 기숙사 운영, 통근버스 운행
• 교육/생활 : 구내식당(사원식당), 점심식사 제공, 사내동호회 운영
• 조직 문화 : 노사협의회
• 선물 : 명절선물
• 근무 환경 : 수유실, 사내 어린이집 운영, 휴게실, 회의실, 콘도/리조트 이용권, 사무용품 지급
• 리프레시 : 산전 후 휴가, 육아휴직, 남성출산휴가, 보건휴가, 휴양시설 제공

🚀 채용절차

• 접수기간 : 2026-10-15 11시 ~ 2026-10-25 24시
• 제출서류 : 사람인 온라인 이력서
• 접수방법 : 사람인 입사지원
• 전형절차 : 서류전형 → 실무면접 → 임원면접 → 최종합격

🛎️ 유의사항

• 입사지원 서류에 허위사실이 발견될 경우, 채용확정 이후라도 채용이 취소될 수 있습니다.