Packaging - 600+ job offers

Job Details Job Description The Role And Impact Intel is seeking a motivated and innovative Layout Design Engineer to join our team of world-class semiconductor professionals. In this role, you will be at the forefront of designing the physical layout of of Intel's silicon that are used for its pack

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have be

As a Packaging Trainee , you will be part of the core Supply Chain operations that ensure our products are safely, efficiently, and consistently packaged before reaching customers and consumers. The role is responsible for supporting daily production activities across the assigned machine and zone,

The Senior Graphic Designer will be responsible for creating visually stunning and effective designs that communicate our brand message and a knack for understanding what consumers truly desire. The successful candidate will work closely with the marketing team to develop creative concepts and deliv

Ideal Quality Sdn. Bhd.

JOB RESPONSIBILITIES Must ensure the stamping is correct Meet the printing output Maintain good housekeeping Follow working procedure JOB REQUIREMENTS: Minimum SPM level Able to read and write the number Good communication skill Good attendance Pay: RM1,700.00 per month Benefits Free parking Parenta

The Manufacturing & Packaging Operator is responsible for operating production machinery, handling raw materials, and ensuring products are manufactured and packaged according to company quality and safety standards. Key Responsibilities Operate and monitor manufacturing and packaging machines e

Job Description ESSENTIAL DUTIES AND RESPONSIBILITIES: BOP (Back‑End of Process) AOI processes include SBA, Laser Marking, Laser Cutting, PKG saw and Painting development for LGA/BGA product assemblies Develop and optimize new BOP process recipes to achieve high capability for new products Collabora

Job Description ESSENTIAL DUTIES AND RESPONSIBILITIES: Develops and leads SiP (System in Package) assembly and IC packaging material and processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements. Leads new package and SMT/Flip Chip/Underfill process qualificati

CORE RESPONSIBILITY: Visit customer’s site Visit customer’s site to observe technical functions e.g. line running, technical issues Collect necessary data at customer site, to analyze actual problem upon technical-wise Able to find root cause, based on TS manager supervision Able to build up good re

Agroto Business M Sdn Bhd

Job Responsibilities: Assist in daily operations of collection, processing, and packaging activities Support receiving, sorting, and handling of incoming goods/materials Assist in basic processing tasks in accordance with standard operating procedures (SOP) Support packaging activities to ensure pro

As a Packaging Trainee , you will be part of the core Supply Chain operations that ensure our products are safely, efficiently, and consistently packaged before reaching customers and consumers. The role is responsible for supporting daily production activities across the assigned machine and zone,

Job Description ESSENTIAL DUTIES AND RESPONSIBILITIES: Conduct comprehensive commonality analyses across product design, processes, machinery, materials, and measurement methodologies. Facilitate cross-functional collaboration to execute Root Cause Corrective Action (RCCA) initiatives with maximum e

Hays Recruitment

Your new company You will be working for an established provider of packaging and printing solutions, offering innovative and high-quality services to meet the needs of various industries. With a strong emphasis on quality, it delivers tailored and environmentally conscious packaging solutions. Your

Job Description We are seeking an experienced Device Physical Failure Analysis (PFA) Engineer with mandatory hands-on SEM and FIB expertise to support advanced semiconductor chip and package development. This role is part of the Chip Package Integration (CPI) Failure Analysis function and plays a ke

Job Description: Material Requirement Planning ownership for commodity (DM/ODM/IDM), ensuring 100% assurance of supply for manufacturing plant operations (ASSY, Test, Mark & Pack). Primary contact person within the manufacturing plant for inventory control for DM/ ODMs/IDMs/ issues and providing