Houzen Chen
Process Integration Engineer
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About
Responsible for process flow optimisation, troubleshooting, and abnormal analysis Set up and configured process parameters for a variety of semiconductor equipment, optimising process management projects with improved process condition and technology Evaluation, promotion and planning of new equipment/materials across several modules of semiconductor manufacturing (photolithography, dry/wet etching, physical/chemical vapour deposition, chemical mechanical planarization, ion implantation, wafer cleaning, metrology/real-time defect analysis, etc.)
Experience
Process Integration Engineer at Micron Technology, Inc. (2022-08 – 2026-02)
- Responsible for process flow optimisation, troubleshooting, and abnormal analysis
- Set up and configured process parameters for a variety of semiconductor equipment, optimising process management projects with improved process condition and technology
- Evaluation, promotion and planning of new equipment/materials across several modules of semiconductor manufacturing (photolithography, dry/wet etching, physical/chemical vapour deposition, chemical mechanical planarization, ion implantation, wafer cleaning, metrology/real-time defect analysis, etc.)
- Led a data-driven enhancement initiative utilising AI-based yield prediction models, pinpointing essential material and process characteristics influencing yield variability, resulting in a 20% decrease in project validation duration and more than USD $10 million in cost savings (approximately 3% of the company's yearly savings target)
Process Integration Engineer at Win Semiconductor Corp. (2022-02 – 2022-07)
- Optimized epitaxy (EPI) quality by tuning parameters of EPI equipment and resolving issues caused by EPI quality
- Monitored EPI quality by Statistical Process Control (SPC), ensuring optimal process flow and product yield
- Communicated with EPI supplier to implement new technology and resolve customer complaints
- Conducted data analysis on unpredictable issues occurring in EPI process by Electronic Design Automation (EDA) system, analysing the root causes and composing corrective and preventive plans with related departments
Education
M.S. in Modelling and Simulation – Nanyang Technological University (NTU) (2026-08)
M.S. in Materials Science and Engineering – National Tsing Hua University (NTHU) (2019-09 – 2021-08)
B.S. in Materials Science and Engineering – National Cheng Kung University (NCKU) (2015-09 – 2019-06)