{year}年在Zhubei附近找到9,605+個職位。比較薪資，在BeBee免費申請。
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· 頁 1 / 481Company Description Job Summary • Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging, GaN related PKG is a plus. • Package technologies qualification for consumer &a
Minimum qualifications: Bachelor's degree or equivalent practical experience. 10 years of experience in program or project management. 10 years of experience in semiconductor planning and fulfillment, and experience with mobile SoC development flows and manufacturing processes for Foundry, Die Prep,
Overview Bruker is enabling scientists to make breakthrough discoveries and develop new applications that improve the quality of human life. Bruker’s high performance scientific instruments and high value analytical and diagnostic solutions enable scientists to explore life and materials at molecula
Sr Staff Program Manager Job Description We are seeking a highly motivated and disciplined Project/Program Manager to join our Central PMO office in Analog & Mixed-Signal Product Group. In this role, you will exhibit full project ownership, acting as the go-to person for internal teams and manag
onsemiTechnical and customer support for the qualification of SiC die sales and development. The candidate must have knowledge of package design, assembly processes and interactions with device. Responsibilities Work with fellow technologists, customers, business unit representatives, sales, reliability,
onsemiLead the development, qualification, and manufacturing release of advanced flip-chip packaging solutions, including substrate-based (FC-BGA, FC-LGA) and leadframe-based technologies. Drive package development from concept through production while working closely with Product Engineering, Silicon Des
Description Job Summary: As a member of the Advanced Packaging team, you will manage various aspects of image sensor packaging technology development, process improvement, and new product introduction including CSP, BGA, LGA and related packages for sensing systems utilized in Automotive, Industrial
Job Description The Staff Foundry Technical Manager serves as the primary technical interface between foundry partners and internal cross-functional teams. This role is responsible for driving new product introductions, technology transfers, yield improvement, quality management, process change cont
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have be
Job Description Job Summary Principal Engineer, GaN Device Engineer , in charge of development of Gallium Nitride (GaN) power devices for high-efficiency power conversion. The candidate will possess expertise in GaN device design & physics to drive high performance/robustness technology. In addi
KLATo make electronics, you need chips, wafers, transistors, reticles, and... To make these, you must see, test and manufacture them at scale—faster and better than ever before. That's where KLA comes in. Whether you're early in your career or an experienced professional, you'll solve complex challenge
新帝Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating hea
安森美半导体Job Description We are seeking an experienced Packaging Designer to lead the design, development, and optimization of advanced power module packaging solutions. The successful candidate will possess extensive expertise in Advanced Package Design (APD) and 3D modeling , combined with a deep understan
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have be
Description Lead the development, qualification, and manufacturing release of advanced flip-chip packaging solutions, including substrate-based (FC-BGA, FC-LGA) and leadframe-based technologies. Drive package development from concept through production while working closely with Product Engineering,
Description Technical and customer support for the qualification of SiC die sales and development. The candidate must have knowledge of package design, assembly processes and interactions with device. Responsibilities Work with fellow technologists, customers, business unit representatives, sales, r
At Altair Semiconductor, we develop advanced wireless and IoT solutions that connect millions of devices worldwide. Our engineers own significant parts of each project, becoming true experts in their fields. You'll work directly with your team from initial concept through final delivery, seeing the
Job Description Job Summary • Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging, GaN related PKG is a plus. • Package technologies qualification for consumer &
Collins AerospaceDate Posted: 2026-10-27 Country: Taiwan Location: TW-HSQ-ZHUBEI-173 ~ No 173 Section 3 Huanbei Rd ~ HUANBEI, 4th Flr Position Role Type: Unspecified Onsite: This position will work onsite at our Taiwan base with occasional travel to support other site. Major Responsibilities but not limited: Chiller
安森美半导体Job Description As a member of the Advanced Packaging team, you will manage various aspects of image sensor packaging technology development, process improvement, and new product introduction including CSP, BGA, LGA and related packages for sensing systems utilized in Automotive, Industrial and Cons
Requirements Description & Requirements 關於我們 lululemon 是一家專門製作瑜伽、跑步、訓練和其他運動項目等機能服飾的創新公司。在高科技布料和功能設計方面，我們樹立標竿，創造顛覆性的產品和體驗，持續在運動健身、心靈成長、人際連結與幸福感方面提供人們所需的協助。我們將成功歸功於創新的產品、對門市的重視、對員工的承諾以及在每個所在社群當中所建立的人際連結。作為一家公司，我們專注於創造正面的改變，期許打造更健康、繁榮的未來。特別值得一提的是，這樣的期許也包含了為我們的員工創造一個公平、包容且注重成長的環境。 工作摘要 關鍵領導人一職是門市領導團
QualcommCompany Qualcomm Semiconductor Limited Job Area Engineering Group, Engineering Group > ASICS Engineering Education General Summary MS/BS in EE (MS preferred). Experience 2–10 years ASIC design experience. Experience in merchant silicon or switching ASIC is desirable. Requirements Familiar with AS
QualcommCompany Qualcomm Semiconductor Limited Job Area Engineering Group, Engineering Group > ASICS Engineering Education General Summary MS/BS in EE (MS preferred). Experience 2–10 years ASIC design experience. Experience in merchant silicon or switching ASIC is desirable. Requirements Familiar with AS
dunhillYOUR MISSION: Manage a sales channel, such as such direct sales, online sales, or retail sales. Develop and implement channel sales strategies that align with the overall business objectives. Identify new business opportunities, set sales targets, and monitor performance metrics to ensure that the c
科林研發The impact you’ll make As a Technical Instructor at Lam, you'll conduct dynamic technical training for customers and employees. You'll craft course content specifications and engaging lesson plans. Collaborating with cross-functional teams, you ensure alignment with the latest product features. Thro
聯發科技Job Description Conduct market/technology trend analysis and customer/product requirements for technical roadmap planning 2. Guide the IP/SoC development with technical background, and collaborate with engineering/marketing teams and 3rd parties for Key features promotion, landing and marketing Main
聯發科技Job Description About the Role We are seeking a highly seasoned Senior Staff+ Graphics Device Driver Engineer to join our GPU engineering organization. Because of your extensive experience, we offer flexible placement within our organization. Whether your deep expertise lies in User Mode Drivers (UM
Texas InstrumentsChange the world. Love your job. In your first year with TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI, and set you up for long-term career success. Within this program, we also offer
Amazon ScienceDescription Are you passionate about robotics and research? Do you want to solve real customer problems through innovative technology? Do you enjoy working on scalable research and projects in a collaborative team environment? Do you want to see your science solutions directly impact millions of cus
